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| 型号： | DMC2020USD-13 |
| 厂商： | Diodes Inc |
| 文件页数： | 2/11页 |
| 文件大小： | 0K |
| 描述： | MOSFET DUAL COMPL PAIR 8SO |
| 标准包装： | 1 |
| FET 型： | N 和 P 沟道 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 20V |
| 电流 - 连续漏极(Id) @ 25° C： | 6.5A，5.2A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 20 毫欧 @ 7A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1.5V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 11.6nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 1149pF @ 10V |
| 功率 - 最大： | 1.25W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | SO-8 |
| 包装： | 标准包装 |
| 其它名称： | DMC2020USD-13DIDKR |
A Product Line of
Diodes Incorporated
DMC2020USD
Maximum Ratings @T A = 25°C unless otherwise specified
Drain-Source Voltage
Gate-Source Voltage
Characteristic
(Notes 3 & 5)
Symbol
V DSS
V GSS
N-Channel - Q1
20
± 10
8.5
P-Channel - Q2
-20
± 10
-6.8
Units
V
Continuous Drain Current
Pulsed Drain Current
V GS = 4.5V
V GS = 4.5V
T A = 70°C (Notes 3 & 5)
(Notes 2 & 5)
(Notes 2 & 6)
(Notes 4 & 5)
I D
I DM
6.8
6.5
7.8
33.6
-5.4
-5.2
-6.3
-26.8
A
Continuous Source Current (Body diode)
Pulsed Source Current (Body diode)
(Notes 3 & 5)
(Notes 4 & 5)
I S
I SM
4.0
33.6
-4.0
-26.8
Thermal Characteristics @T A = 25°C unless otherwise specified
Characteristic
Symbol
N-Channel - Q1 P-Channel - Q2
Unit
Power Dissipation
Linear Derating Factor
(Notes 2 & 5)
(Notes 2 & 6)
P D
1.25
10
1.8
14.3
W
mW/ ° C
(Notes 3 & 5)
(Notes 2 & 5)
2.14
17.2
100
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and Storage Temperature Range
(Notes 2 & 6)
(Notes 3 & 5)
(Notes 5 & 7)
R θ JA
R θ JL
T J, T STG
70
58
51
-55 to +150
°C/W
°C
Notes:
2. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note (2), except the device is measured at t ≤ 10 sec.
4. Same as note (2), except the device is pulsed with D = 0.02 and pulse width 300μs.
5. For a dual device with one active die.
6. For a device with two active die running at equal power.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).
DMC2020USD
Document number: DS32121 Rev. 4 - 2
2 of 11
www.diodes.com
February 2011
? Diodes Incorporated
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