参数资料
型号: DS21352L
厂商: Maxim Integrated Products
文件页数: 106/137页
文件大小: 0K
描述: IC TXRX T1 1-CHIP 3.3V 100-LQFP
产品培训模块: Lead (SnPb) Finish for COTS
产品变化通告: Product Discontinuation 20/Feb/2012
标准包装: 90
功能: 单芯片收发器
接口: HDLC,T1
电路数: 1
电源电压: 3.14 V ~ 3.47 V
电流 - 电源: 75mA
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 100-LQFP
供应商设备封装: 100-LQFP(14x14)
包装: 托盘
包括: DSX-1 和 CSU 线路补偿发生器,HDLC 控制器,带内回路代码发生器和检测器
DS21352/DS21552
70 of 137
15.3.3.2 TRANSMIT AN HDLC MESSAGE
1) Make sure HDLC controller is done sending any previous messages and is current sending flags by checking that the
FIFO is empty by reading the TEMPTY status bit in the TPRM register.
2) Enable either the THALF or TNF interrupt.
3) Read THIR to obtain TFULL status.
a) If TFULL=0, then write a byte into the FIFO and skip to next step (special case occurs when the last byte is to be
written, in this case set TEOM=1 before writing the byte and then skip to step 6).
b) If TFULL=1, then skip to step 5.
4) Repeat step 3.
5) Wait for interrupt, skip to step 3.
6) Disable THALF or TNF interrupt and enable TMEND interrupt.
7) Wait for an interrupt, then read TUDR status bit to make sure packet was transmitted correctly.
15.3.3.3 TRANSMIT A BOC
1) Write 6–bit code into TBOC.
2) Set SBOC bit in TBOC=1.
15.3.4 HDLC/BOC Register Description
HCR: HDLC CONTROL REGISTER (Address=00 Hex)
(MSB)
(LSB)
RBR
RHR
TFS
THR
TABT
TEOM
TZSD
TCRCD
SYMBOL
POSITION
NAME AND DESCRIPTION
RBR
HCR.7
Receive BOC Reset. A 0 to 1 transition will reset the BOC circuitry. Must be cleared
and set again for a subsequent reset.
RHR
HCR.6
Receive HDLC Reset. A 0 to 1 transition will reset the HDLC controller. Must be
cleared and set again for a subsequent reset.
TFS
HCR.5
Transmit Flag/Idle Select.
0 = 7Eh
1 = FFh
THR
HCR.4
Transmit HDLC Reset. A 0 to 1 transition will reset both the HDLC controller and the
transmit BOC circuitry. Must be cleared and set again for a subsequent reset.
TABT
HCR.3
Transmit Abort. A 0 to 1 transition will cause the FIFO contents to be dumped and one
FEh abort to be sent followed by 7Eh or FFh flags/idle until a new packet is initiated by
writing new data into the FIFO. Must be cleared and set again for a subsequent abort to
be sent.
TEOM
HCR.2
Transmit End of Message. Should be set to a one just before the last data byte of a
HDLC packet is written into the transmit FIFO at TFFR. This bit will be cleared by the
HDLC controller when the last byte has been transmitted.
TZSD
HCR.1
Transmit Zero Stuffer Defeat. Overrides internal enable.
0 = enable the zero stuffer (normal operation)
1 = disable the zero stuffer
TCRCD
HCR.0
Transmit CRC Defeat.
0 = enable CRC generation (normal operation)
1 = disable CRC generation
HSR: HDLC STATUS REGISTER (Address=01 Hex)
(MSB)
(LSB)
RBOC
RPE
RPS
RHALF
RNE
THALF
TNF
TMEND
SYMBOL
POSITION
NAME AND DESCRIPTION
RBOC
HSR.7
Receive BOC Detector Change of State. Set whenever the BOC detector sees a
change of state from a BOC Detected to a No Valid Code seen or vice versa. The setting
of this bit prompt the user to read the RBOC register for details.
相关PDF资料
PDF描述
VI-B5K-IY-F1 CONVERTER MOD DC/DC 40V 50W
DS21554L IC TXRX E1 1-CHIP 5V 100-LQFP
VI-B5J-IY-F2 CONVERTER MOD DC/DC 36V 50W
VI-B5H-IY-F4 CONVERTER MOD DC/DC 52V 50W
VI-B5H-IY-F1 CONVERTER MOD DC/DC 52V 50W
相关代理商/技术参数
参数描述
DS21352L+ 功能描述:网络控制器与处理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21352LB 功能描述:网络控制器与处理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21352LB+ 功能描述:网络控制器与处理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21352LBN 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS21352L-C02 功能描述:网络控制器与处理器 IC T1 Single Chip Transceivers RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray