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参数资料
型号： DS3112N
厂商： Maxim Integrated Products
文件页数： 46/133页
文件大小： 0K
描述： IC MUX TEMPE T3/E3 IND 256-BGA
产品培训模块： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装： 40
控制器类型： 调帧器，多路复用器
接口： 并行/串行
电源电压： 3.135 V ~ 3.465 V
电流 - 电源： 150mA
工作温度： -40°C ~ 85°C
安装类型： 表面贴装
封装/外壳： 256-LBGA
供应商设备封装： 256-PBGA（27x27）
包装： 管件
DS3112
TABLE OF CONTENTS
1
DETAILED DESCRIPTION
7
1.1
APPLICABLE STANDARDS ..............................................................................................................8
1.2
MAIN DS3112 TEMPE FEATURES................................................................................................9
1.2.1
General Features ................................................................................................................................... 9
1.2.2
T3/E3 Framer ......................................................................................................................................... 9
1.2.3
T2/E2 Framer ......................................................................................................................................... 9
1.2.4
HDLC Controller..................................................................................................................................... 9
1.2.5
FEAC Controller ..................................................................................................................................... 9
1.2.6
BERT.................................................................................................................................................... 10
1.2.7
Diagnostics........................................................................................................................................... 10
1.2.8
Control Port .......................................................................................................................................... 10
1.2.9
Packaging and Power .......................................................................................................................... 10
2
PIN DESCRIPTION
14
2.2
CPU BUS SIGNAL DESCRIPTION .................................................................................................19
2.3
T3/E3 RECEIVE FRAMER SIGNAL DESCRIPTION ...........................................................................21
2.4
T3/E3 TRANSMIT FORMATTER SIGNAL DESCRIPTION ...................................................................23
2.5
LOW-SPEED (T1 OR E1) RECEIVE PORT SIGNAL DESCRIPTION ....................................................25
2.6
LOW-SPEED (T1 OR E1) TRANSMIT PORT SIGNAL DESCRIPTION ..................................................26
2.7
HIGH-SPEED (T3 OR E3) RECEIVE PORT SIGNAL DESCRIPTION ...................................................28
2.8
HIGH-SPEED (T3 OR E3) TRANSMIT PORT SIGNAL DESCRIPTION .................................................28
2.9
JTAG SIGNAL DESCRIPTION .......................................................................................................29
2.10
SUPPLY, TEST, RESET, AND MODE SIGNAL DESCRIPTION ............................................................29
3
MEMORY MAP
31
4
MASTER DEVICE CONFIGURATION AND STATUS/INTERRUPT
33
4.1
MASTER RESET AND ID REGISTER DESCRIPTION.........................................................................33
4.2
MASTER CONFIGURATION REGISTERS DESCRIPTION ...................................................................34
4.3
MASTER STATUS AND INTERRUPT REGISTER DESCRIPTION..........................................................38
4.3.1
Status Registers................................................................................................................................... 38
4.3.2
MSR ..................................................................................................................................................... 39
4.4
TEST REGISTER DESCRIPTION ....................................................................................................47
5
T3/E3 FRAMER
48
5.1
T3/E3 LINE LOOPBACK ...............................................................................................................48
5.2
T3/E3 DIAGNOSTIC LOOPBACK ...................................................................................................48
5.3
T3/E3 PAYLOAD LOOPBACK........................................................................................................48
5.4
T3/E3 FRAMER CONTROL REGISTER DESCRIPTION .....................................................................49
5.5
T3/E3 FRAMER STATUS AND INTERRUPT REGISTER DESCRIPTION ...............................................53
5.6
T3/E3 PERFORMANCE ERROR COUNTERS ..................................................................................59
6
M13/E13/G.747 MULTIPLEXER AND T2/E2/G.747 FRAME
62
6.1
T1/E1 AIS GENERATION.............................................................................................................62
6.2
T2/E2/G.747 FRAMER CONTROL REGISTER DESCRIPTION ..........................................................62
6.3
T2/E2/G.747 FRAMER STATUS AND INTERRUPT REGISTER DESCRIPTION ....................................64
6.4
T1/E1 AIS GENERATION CONTROL REGISTER DESCRIPTION .......................................................68
7
T1/E1 LOOPBACK AND DROP AND INSERT FUNCTIONALITY
70
7.1
T1/E1 LINE LOOPBACK ...............................................................................................................70
7.2
T1/E1 DIAGNOSTIC LOOPBACK ...................................................................................................70
7.3
T1 LINE LOOPBACK COMMAND....................................................................................................70
7.4
T1/E1 DROP AND INSERT............................................................................................................70
2 of 133
7.5
T1/E1 LOOPBACK CONTROL REGISTER DESCRIPTION .................................................................71
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相关代理商/技术参数
参数描述
DS3112N+ 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS3112N+W 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS3112NC1 制造商:Maxim Integrated Products 功能描述:T3 E3 MULTIPLEXER, 3.3V T3/E3 FRAMER AND M13/E13/G.747 MUX - Rail/Tube
DS3112ND1E 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS3112RD 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
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