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参数资料
| 型号： | EE-SY1200 |
| 厂商： | Omron Electronics Inc-EMC Div |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | SENSOR PHOTO ULTRA COMP SMD |
| 标准包装： | 1 |
| 检测方法： | 反射 |
| 电压 - 集电极发射极击穿（最大）： | 30V |
| 电流 - 集电极 (Ic)（最大）： | 20mA |
| 电流 - DC 正向(If)： | 50mA |
| 输出类型： | 光电晶体管 |
| 响应时间： | 30µs，30µs |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-SMD，无引线 |
| 包装： | 标准包装 |
| 工作温度： | -25°C ~ 85°C |
| 其它名称： | OR1038DKR |
EE-SY1200
■ Precautions to be taken on mounting
● Temperature Profile
The reflow soldering can be implemented in two
times complying with the following diagram.
All the temperatures in the product must be within
the diagram.
240°C MAX.
●
Treatment after Opening
1. Reflow soldering must be done within 48 hours
stored at the conditions of humidity 60%RH or
less and temperature 5 to 25 ° C.
2. In case of long time storage after open, please
mount at the conditions of humidity 70%RH or
less and temperature 5 to 30 ° C within 1 week by
using dry box or resealing with desiccant in mois-
ture-proof bag by sealer.
1to 4°C/sec
200°C
●
Baking before Mounting
1to 4°C/sec
160°C MAX.
10 sec MAX.
50 sec MAX.
1to 4°C/sec
In case that it could not carry out the above treat-
ment, it is able to mount by baking treatment.
However baking treatment shall be limited only 1
time.
Recommended conditions : 60 ° C, 12 to 24 hours
120 sec MAX.
Time (sec)
(reeled one)
100 ° C, 8 to 24 hours
(loose one)
●
●
Manual soldering
The manual soldering cannot be applied to the prod-
ucts.
There is a possibility that the housing is deformed
and/or Au plating is peeled off by heat.
Other Notes
The use of infrared lamp causes the temperature at
the resin to rise particularly too high.
All the temperatures in the product must be within
the above diagram.
Do not immerse the resin part into the solder.
Even if within the above temperature diagram, there
is a possibility that the gold wire in the products is
broken in case that the deformation of PCB gives the
stress to the product terminals.
Please confirm the conditions of the reflow soldering
fully by actual solder reflow machine prior to the
mass production use.
■ Storage and Handling after Opening
● Storage Conditions
In order to avoid the absorption of moisture, the
products shall be stored in a dry box with desiccant
or in the following conditions.
Storage temp. : 5 to 30 ° C
Storage humidity : 70%RH or less
4
相关PDF资料 |
PDF描述 |
|---|---|
| EE-SY124 | SENSR OPTO TRANS 1MM REFL TH PCB |
| EE-SY125 | OPTO SENSOR 1MM REFLECT SMD |
| EE-SY169A-D | PHOTOMICROSENSORW/PLASTIC COVR |
| EE-SY169 | SENSR OPTO TRANS 4MM REFL TH PCB |
| EE-SY171 | SENSOR OPTO TRANS 3.5MM REFL PCB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| EESY12001 | 制造商:Omron Electronic Components LLC 功能描述:PHOTOMICROSENSOR REFLECTIVE |
| EESY124 | 制造商:Omron Electronic Components LLC 功能描述:SENSR OPTO TRANS 1MM REFL TH PCB 制造商:Omron Electronic Components LLC 功能描述:OPTO SWITCH REFLECTIVE 1MM |
| EE-SY124 | 功能描述:光学开关（反射型，光电晶体管输出） REFL PHOTOTRANSISTOR RoHS:否 制造商:Fairchild Semiconductor 感应距离:1 mm 输出设备:Phototransistor 集电极—发射极最大电压 VCEO:30 V 最大集电极电流:20 mA 正向电压:1.2 V 反向电压:5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 安装风格:SMD/SMT 封装:Reel |
| EESY125 | 制造商:Omron Electronic Components LLC 功能描述:OPTO SENSOR 1MM REFLECT SMD 制造商:Omron Electronic Components LLC 功能描述:OPTO SWITCH REFLECTIVE 1MM |
| EE-SY125 | 功能描述:光学开关（反射型，光电晶体管输出） REFL PHOTOTRANSISTOR RoHS:否 制造商:Fairchild Semiconductor 感应距离:1 mm 输出设备:Phototransistor 集电极—发射极最大电压 VCEO:30 V 最大集电极电流:20 mA 正向电压:1.2 V 反向电压:5 V 最大工作温度:+ 85 C 最小工作温度:- 25 C 安装风格:SMD/SMT 封装:Reel |
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