参数资料
型号: EP2AGX65DF25I3
厂商: Altera
文件页数: 14/90页
文件大小: 0K
描述: IC ARRIA II GX FPGA 65K 572FBGA
标准包装: 5
系列: Arria II GX
LAB/CLB数: 2530
逻辑元件/单元数: 60214
RAM 位总计: 5371904
输入/输出数: 252
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 572-FBGA
供应商设备封装: 572-FBGA
Chapter 1: Device Datasheet for Arria II Devices
1–13
Electrical Characteristics
December 2013
Altera Corporation
Table 1–17 lists the pin capacitance for Arria II GZ devices.
Internal Weak Pull-Up and Weak Pull-Down Resistors
Table 1–18 lists the weak pull-up and pull-down resistor values for Arria II GX
devices.
Table 1–17. Pin Capacitance for Arria II GZ Devices
Symbol
Description
Typical
Unit
CIOTB
Input capacitance on the top and bottom I/O pins
4
pF
CIOLR
Input capacitance on the left and right I/O pins
4
pF
CCLKTB
Input capacitance on the top and bottom non-dedicated clock input pins
4
pF
CCLKLR
Input capacitance on the left and right non-dedicated clock input pins
4
pF
COUTFB
Input capacitance on the dual-purpose clock output and feedback pins
5
pF
CCLK1, CCLK3, CCLK8,
and CCLK10
Input capacitance for dedicated clock input pins
2
pF
Table 1–18. Internal Weak Pull-up and Weak Pull-Down Resistors for Arria II GX Devices
Symbol
Description
Conditions
Min
Typ
Max
Unit
RPU
Value of I/O pin pull-up resistor
before and during configuration,
as well as user mode if the
programmable pull-up resistor
option is enabled.
VCCIO = 3.3 V ±5% (2)
725
41
k
VCCIO = 3.0 V ±5% (2)
728
47
k
VCCIO = 2.5 V ±5% (2)
835
61
k
VCCIO = 1.8 V ±5% (2)
10
57
108
k
VCCIO = 1.5 V ±5% (2)
13
82
163
k
VCCIO = 1.2 V ±5% (2)
19
143
351
k
RPD
Value of TCK pin pull-down
resistor
VCCIO = 3.3 V ±5%
6
19
29
k
VCCIO = 3.0 V ±5%
6
22
32
k
VCCIO = 2.5 V ±5%
6
25
42
k
VCCIO = 1.8 V ±5%
7
35
70
k
VCCIO = 1.5 V ±5%
8
50
112
k
Notes to Table 1–18:
(1) All I/O pins have an option to enable weak pull-up except configuration, test, and JTAG pins. The weak pull-down feature is only available for
JTAG TCK.
(2) Pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO.
相关PDF资料
PDF描述
EP2AGX45DF29I3 IC ARRIA II GX FPGA 45K 780FBGA
IDT7164S20TPGI IC SRAM 64KBIT 20NS 28DIP
EP2AGX45DF25I3 IC ARRIA II GX FPGA 45K 572FBGA
EP2AGX125DF25I3N IC ARRIA II GX FPGA 125K 572FBGA
IDT71V547S80PFGI8 IC SRAM 4MBIT 80NS 100TQFP
相关代理商/技术参数
参数描述
EP2AGX65DF25I3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 252 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF25I5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 252 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF25I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 252 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29C4 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29C4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256