参数资料
型号: EP2AGX65DF29C6N
厂商: Altera
文件页数: 52/90页
文件大小: 0K
描述: IC ARRIA II GX FPGA 65K 780FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 4
系列: Arria II GX
LAB/CLB数: 2530
逻辑元件/单元数: 60214
RAM 位总计: 5371904
输入/输出数: 364
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 780-BBGA
供应商设备封装: 780-FBGA(29x29)
1–48
Chapter 1: Device Datasheet for Arria II Devices
Switching Characteristics
December 2013
Altera Corporation
Peak-to-peak jitter
Jitter frequency = 22.1 KHz
> 8.5
UI
Peak-to-peak jitter
Jitter frequency =
1.875 MHz
> 0.1
UI
Peak-to-peak jitter
Jitter frequency = 20 MHz
> 0.1
UI
PCIe Transmit Jitter Generation (8)
Total jitter at 2.5 Gbps (Gen1)—
x1, x4, and x8
Compliance pattern
0.25
0.25
UI
Total jitter at 5 Gbps (Gen2)—
x1, x4, and x8
Compliance pattern
0.25
UI
PCIe Receiver Jitter Tolerance (8)
Total jitter at 2.5 Gbps (Gen1)
Compliance pattern
> 0.6
UI
Total jitter at 5 Gbps (Gen2)
Compliance pattern
Not supported
UI
PCIe (Gen 1) Electrical Idle Detect Threshold
VRX-IDLE-DETDIFFp-p (9)
Compliance pattern
65
175
65
175
UI
SRIO Transmit Jitter Generation (10)
Deterministic jitter
(peak-to-peak)
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
0.17
0.17
UI
Total jitter (peak-to-peak)
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
0.35
0.35
UI
SRIO Receiver Jitter Tolerance (10)
Deterministic jitter tolerance
(peak-to-peak)
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
> 0.37
UI
Combined deterministic and
random jitter tolerance (peak-to-
peak)
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
> 0.55
UI
Sinusoidal jitter tolerance (peak-
to-peak)
Jitter frequency = 22.1 KHz
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
> 8.5
UI
Jitter frequency = 1.875 MHz
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
> 0.1
UI
Jitter frequency = 20 MHz
Data rate = 1.25, 2.5, 3.125 Gbps
Pattern = CJPAT
> 0.1
UI
GIGE Transmit Jitter Generation (11)
Deterministic jitter
(peak-to-peak)
Pattern = CRPAT
0.14
0.14
UI
Total jitter (peak-to-peak)
Pattern = CRPAT
0.279
0.279
UI
Table 1–41. Transceiver Block Jitter Specifications for Arria II GZ Devices (Note 1), (2) (Part 3 of 7)
Symbol/
Description
Conditions
–C3 and –I3
–C4 and –I4
Unit
Min
Typ
Max
Min
Typ
Max
相关PDF资料
PDF描述
RMC49DRAS-S734 CONN EDGECARD 98POS .100 R/A PCB
A42MX36-3PQ240I IC FPGA MX SGL CHIP 54K 240-PQFP
GBB108DHAR CONN EDGECARD 216PS R/A .050 SLD
A42MX36-3PQG240I IC FPGA MX SGL CHIP 54K 240-PQFP
EP1S10F780I6 IC STRATIX FPGA 10K LE 780-FBGA
相关代理商/技术参数
参数描述
EP2AGX65DF29C6NES 制造商:Altera Corporation 功能描述:FPGA Arria
EP2AGX65DF29I3 功能描述:IC ARRIA II GX FPGA 65K 780FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Arria II GX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
EP2AGX65DF29I3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29I5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256