参数资料
| 型号： | EP4S100G5F45I1 |
| 厂商： | Altera |
| 文件页数： | 5/22页 |
| 文件大小： | 0K |
| 描述： | IC STRATIX IV FPGA 530K 1932FBGA |
| 产品培训模块： | Three Reasons to Use FPGA's in Industrial Designs |
| 标准包装： | 3 |
| 系列： | STRATIX® IV GT |
| LAB/CLB数： | 21248 |
| 逻辑元件/单元数： | 531200 |
| RAM 位总计： | 28033024 |
| 输入/输出数： | 781 |
| 电源电压： | 0.92 V ~ 0.98 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 1932-BBGA |
| 供应商设备封装： | 1932-FBGA（45x45） |
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Table 1–2 lists the Stratix IV GX device package options.
1 On-package decoupling reduces the need for on-board or PCB decoupling capacitors by satisfying the transient current
requirements at higher frequencies. The Power Delivery Network design tool for Stratix IV devices accounts for the on-package
decoupling and reflects the reduced requirements for PCB decoupling capacitors.
Device
F780
(29 mm x 29 mm) (6)
F1152
(35 mm x 35 mm)
F1152
(35 mm x 35 mm) (5), (7)
F1517
(40 mm x 40 mm)
F1760
(42.5 mm x 42.5 mm)
F1932
(45 mm x 45 mm)
EP4SGX70
DF29
—
HF35
—
EP4SGX110
DF29
—
FF35
HF35
—
EP4SGX180
DF29
—
FF35
—
HF35
KF40
—
EP4SGX230
DF29
—
FF35
—
HF35
KF40
—
EP4SGX290
—
FH29 (3)
FF35
—
HF35
KF40
KF43
NF45
EP4SGX360
—
FH29 (3)
FF35
—
HF35
KF40
KF43
NF45
EP4SGX530
—
HH35 (4)
KH40 (4)
KF43
NF45
Notes to Table 1–2:
(1) Device packages in the same column and marked under the same arrow sign have vertical migration capability.
(2) Use the Pin Migration Viewer in the Pin Planner to verify the pin migration compatibility when migrating devices. For more information, refer to I/O Management in the Quartus II Handbook, Volume 2.
(3) The 780-pin EP4SGX290 and EP4SGX360 devices are available only in 33 mm x 33 mm Hybrid flip chip package.
(4) The 1152-pin and 1517-pin EP4SGX530 devices are available only in 42.5 mm x 42.5 mm Hybrid flip chip packages.
(5) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information, refer to the Package Information Datasheet for Altera Devices.
(6) Devices listed in this column are available in –2x, –3, and –4 speed grades. These devices do not have on-package decoupling capacitors.
(7) Devices listed in this column are available in –2, –3, and –4 speed grades. These devices have on-package decoupling capacitors. For more information about on-package decoupling capacitor value
in each device, refer to Table 1–3.
相关PDF资料 |
PDF描述 |
|---|---|
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EP4S100G5F45I1N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV 21248 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP4S100G5F45I1NGA | 制造商:Altera Corporation 功能描述: |
| EP4S100G5F45I2 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV 21248 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP4S100G5F45I2N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV 21248 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP4S100G5F45I3 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV 21248 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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