参数资料
型号: EPF10K130EFC484-1X
厂商: Altera
文件页数: 35/100页
文件大小: 0K
描述: IC FLEX 10KE FPGA 130K 484-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 60
系列: FLEX-10KE®
LAB/CLB数: 832
逻辑元件/单元数: 6656
RAM 位总计: 65536
输入/输出数: 369
门数: 342000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 484-BGA
供应商设备封装: 484-FBGA(23x23)
其它名称: EPF10K130EFC4841X
4
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
General
Description
Altera FLEX 10KE devices are enhanced versions of FLEX 10K devices.
Based on reconfigurable CMOS SRAM elements, the FLEX architecture
incorporates all features necessary to implement common gate array
megafunctions. With up to 200,000 typical gates, FLEX 10KE devices
provide the density, speed, and features to integrate entire systems,
including multiple 32-bit buses, into a single device.
The ability to reconfigure FLEX 10KE devices enables 100
% testing prior
to shipment and allows the designer to focus on simulation and design
verification. FLEX 10KE reconfigurability eliminates inventory
management for gate array designs and generation of test vectors for fault
coverage.
Table 5 shows FLEX 10KE performance for some common designs. All
performance values were obtained with Synopsys DesignWare or LPM
functions. Special design techniques are not required to implement the
applications; the designer simply infers or instantiates a function in a
Verilog HDL, VHDL, Altera Hardware Description Language (AHDL), or
schematic design file.
Table 4. FLEX 10KE Package Sizes
Device
144-
Pin
TQFP
208-Pin
PQFP
240-Pin
PQFP
RQFP
256-Pin
FineLine
BGA
356-
Pin
BGA
484-Pin
FineLine
BGA
599-Pin
PGA
600-
Pin
BGA
672-Pin
FineLine
BGA
Pitch (mm)
0.50
1.0
1.27
1.0
1.27
1.0
Area (mm2)
484
936
1,197
289
1,225
529
3,904
2,025
729
Length
× width
(mm
× mm)
22
× 22 30.6 × 30.6 34.6 × 34.6 17 × 17 35 × 35 23 × 23 62.5 × 62.5 45 × 45 27 × 27
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EPF10K130EFC484-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-2X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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EPF10K130EFC484-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256