参数资料
| 型号： | EPF10K130EFC484-1X |
| 厂商： | Altera |
| 文件页数： | 98/100页 |
| 文件大小： | 0K |
| 描述： | IC FLEX 10KE FPGA 130K 484-FBGA |
| 产品培训模块： | Three Reasons to Use FPGA's in Industrial Designs |
| 标准包装： | 60 |
| 系列： | FLEX-10KE® |
| LAB/CLB数： | 832 |
| 逻辑元件/单元数： | 6656 |
| RAM 位总计： | 65536 |
| 输入/输出数： | 369 |
| 门数： | 342000 |
| 电源电压： | 2.375 V ~ 2.625 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 484-BGA |
| 供应商设备封装： | 484-FBGA（23x23） |
| 其它名称： | EPF10K130EFC4841X |
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Altera Corporation
97
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
During initialization, which occurs immediately after configuration, the
device resets registers, enables I/O pins, and begins to operate as a logic
device. The I/O pins are tri-stated during power-up, and before and
during configuration. Together, the configuration and initialization
processes are called command mode; normal device operation is called user
mode.
SRAM configuration elements allow FLEX 10KE devices to be
reconfigured in-circuit by loading new configuration data into the device.
Real-time reconfiguration is performed by forcing the device into
command mode with a device pin, loading different configuration data,
reinitializing the device, and resuming user-mode operation. The entire
reconfiguration process requires less than 85 ms and can be used to
reconfigure an entire system dynamically. In-field upgrades can be
performed by distributing new configuration files.
Before and during configuration, all I/O pins (except dedicated inputs,
clock, or configuration pins) are pulled high by a weak pull-up resistor.
Programming Files
Despite being function- and pin-compatible, FLEX 10KE devices are not
programming- or configuration file-compatible with FLEX 10K or
FLEX 10KA devices. A design therefore must be recompiled before it is
transferred from a FLEX 10K or FLEX 10KA device to an equivalent
FLEX 10KE device. This recompilation should be performed both to create
a new programming or configuration file and to check design timing in
FLEX 10KE devices, which has different timing characteristics than
FLEX 10K or FLEX 10KA devices.
FLEX 10KE devices are generally pin-compatible with equivalent
FLEX 10KA devices. In some cases, FLEX 10KE devices have fewer I/O
pins than the equivalent FLEX 10KA devices. Table 81 shows which
FLEX 10KE devices have fewer I/O pins than equivalent FLEX 10KA
devices. However, power, ground, JTAG, and configuration pins are the
same on FLEX 10KA and FLEX 10KE devices, enabling migration from a
FLEX 10KA design to a FLEX 10KE design.
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相关代理商/技术参数 |
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| EPF10K130EFC484-2 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K130EFC484-2N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K130EFC484-2X | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K130EFC484-3 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K130EFC484-3N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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