参数资料
型号: EPF10K130EFC484-1X
厂商: Altera
文件页数: 57/100页
文件大小: 0K
描述: IC FLEX 10KE FPGA 130K 484-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 60
系列: FLEX-10KE®
LAB/CLB数: 832
逻辑元件/单元数: 6656
RAM 位总计: 65536
输入/输出数: 369
门数: 342000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 484-BGA
供应商设备封装: 484-FBGA(23x23)
其它名称: EPF10K130EFC4841X
6
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Similar to the FLEX 10KE architecture, embedded gate arrays are the
fastest-growing segment of the gate array market. As with standard gate
arrays, embedded gate arrays implement general logic in a conventional
“sea-of-gates” architecture. Additionally, embedded gate arrays have
dedicated die areas for implementing large, specialized functions. By
embedding functions in silicon, embedded gate arrays reduce die area
and increase speed when compared to standard gate arrays. While
embedded megafunctions typically cannot be customized, FLEX 10KE
devices are programmable, providing the designer with full control over
embedded megafunctions and general logic, while facilitating iterative
design changes during debugging.
Each FLEX 10KE device contains an embedded array and a logic array.
The embedded array is used to implement a variety of memory functions
or complex logic functions, such as digital signal processing (DSP), wide
data-path manipulation, microcontroller applications, and data-
transformation functions. The logic array performs the same function as
the sea-of-gates in the gate array and is used to implement general logic
such as counters, adders, state machines, and multiplexers. The
combination of embedded and logic arrays provides the high
performance and high density of embedded gate arrays, enabling
designers to implement an entire system on a single device.
FLEX 10KE devices are configured at system power-up with data stored
in an Altera serial configuration device or provided by a system
controller. Altera offers the EPC1, EPC2, and EPC16 configuration
devices, which configure FLEX 10KE devices via a serial data stream.
Configuration data can also be downloaded from system RAM or via the
Altera BitBlasterTM, ByteBlasterMVTM, or MasterBlaster download cables.
After a FLEX 10KE device has been configured, it can be reconfigured
in-circuit by resetting the device and loading new data. Because
reconfiguration requires less than 85 ms, real-time changes can be made
during system operation.
FLEX 10KE devices contain an interface that permits microprocessors to
configure FLEX 10KE devices serially or in-parallel, and synchronously or
asynchronously. The interface also enables microprocessors to treat a
FLEX 10KE device as memory and configure it by writing to a virtual
memory location, making it easy to reconfigure the device.
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EPF10K130EFC484-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-2X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256