参数资料
型号: EPF10K130EFC484-1X
厂商: Altera
文件页数: 90/100页
文件大小: 0K
描述: IC FLEX 10KE FPGA 130K 484-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 60
系列: FLEX-10KE®
LAB/CLB数: 832
逻辑元件/单元数: 6656
RAM 位总计: 65536
输入/输出数: 369
门数: 342000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 484-BGA
供应商设备封装: 484-FBGA(23x23)
其它名称: EPF10K130EFC4841X
Altera Corporation
9
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Figure 1 shows a block diagram of the FLEX 10KE architecture. Each
group of LEs is combined into an LAB; groups of LABs are arranged into
rows and columns. Each row also contains a single EAB. The LABs and
EABs are interconnected by the FastTrack Interconnect routing structure.
IOEs are located at the end of each row and column of the FastTrack
Interconnect routing structure.
Figure 1. FLEX 10KE Device Block Diagram
FLEX 10KE devices provide six dedicated inputs that drive the flipflops’
control inputs and ensure the efficient distribution of high-speed, low-
skew (less than 1.5 ns) control signals. These signals use dedicated routing
channels that provide shorter delays and lower skews than the FastTrack
Interconnect routing structure. Four of the dedicated inputs drive four
global signals. These four global signals can also be driven by internal
logic, providing an ideal solution for a clock divider or an internally
generated asynchronous clear signal that clears many registers in the
device.
I/O Element
(IOE)
Logic Array
Block (LAB)
Row
Interconnect
IOE
Local Interconnect
IOE
Logic Element (LE)
Column
Interconnect
IOE
EAB
Logic
Array
IOE
Embedded Array Block (EAB)
Embedded Array
IOE
Logic Array
IOE
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EPF10K130EFC484-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-2X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EFC484-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256