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参数资料
型号： EPF10K30RC208-3N
厂商： Altera
文件页数： 107/128页
文件大小： 0K
描述： IC FLEX 10K FPGA 30K 208-RQFP
产品培训模块： Three Reasons to Use FPGA's in Industrial Designs
产品变化通告： Package Change 30/Jun/2010
标准包装： 48
系列： FLEX-10K®
LAB/CLB数： 216
逻辑元件/单元数： 1728
RAM 位总计： 12288
输入/输出数： 147
门数： 69000
电源电压： 4.75 V ~ 5.25 V
安装类型： 表面贴装
工作温度： 0°C ~ 85°C
封装/外壳： 208-BFQFP 裸露焊盘
供应商设备封装： 240-RQFP（32x32）
其它名称： 544-2228
8
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
The logic array consists of logic array blocks (LABs). Each LAB contains
eight LEs and a local interconnect. An LE consists of a 4-input look-up
table (LUT), a programmable flipflop, and dedicated signal paths for carry
and cascade functions. The eight LEs can be used to create medium-sized
blocks of logic—8-bit counters, address decoders, or state machines—or
combined across LABs to create larger logic blocks. Each LAB represents
about 96 usable gates of logic.
Signal interconnections within FLEX 10K devices and to and from device
pins are provided by the FastTrack Interconnect, a series of fast,
continuous row and column channels that run the entire length and width
of the device.
Each I/O pin is fed by an I/O element (IOE) located at the end of each row
and column of the FastTrack Interconnect. Each IOE contains a
bidirectional I/O buffer and a flipflop that can be used as either an output
or input register to feed input, output, or bidirectional signals. When used
with a dedicated clock pin, these registers provide exceptional
performance. As inputs, they provide setup times as low as 1.6 ns and
hold times of 0 ns; as outputs, these registers provide clock-to-output
times as low as 5.3 ns. IOEs provide a variety of features, such as JTAG
BST support, slew-rate control, tri-state buffers, and open-drain outputs.
Figure 1 shows a block diagram of the FLEX 10K architecture. Each group
of LEs is combined into an LAB; LABs are arranged into rows and
columns. Each row also contains a single EAB. The LABs and EABs are
interconnected by the FastTrack Interconnect. IOEs are located at the end
of each row and column of the FastTrack Interconnect.
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相关代理商/技术参数
参数描述
EPF10K30RC208-4 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC208-4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC240-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC240-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC240-4 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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