参数资料
型号: EPF10K30RC208-3N
厂商: Altera
文件页数: 13/128页
文件大小: 0K
描述: IC FLEX 10K FPGA 30K 208-RQFP
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
产品变化通告: Package Change 30/Jun/2010
标准包装: 48
系列: FLEX-10K®
LAB/CLB数: 216
逻辑元件/单元数: 1728
RAM 位总计: 12288
输入/输出数: 147
门数: 69000
电源电压: 4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 208-BFQFP 裸露焊盘
供应商设备封装: 240-RQFP(32x32)
其它名称: 544-2228
Altera Corporation
11
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Larger blocks of RAM are created by combining multiple EABs. For
example, two 256
× 8 RAM blocks can be combined to form a
256
× 16 RAM block; two 512 × 4 blocks of RAM can be combined to form
a 512
× 8RAM block. See Figure 3.
Figure 3. Examples of Combining EABs
If necessary, all EABs in a device can be cascaded to form a single RAM
block. EABs can be cascaded to form RAM blocks of up to 2,048 words
without impacting timing. Altera’s software automatically combines
EABs to meet a designer’s RAM specifications.
EABs provide flexible options for driving and controlling clock signals.
Different clocks can be used for the EAB inputs and outputs. Registers can
be independently inserted on the data input, EAB output, or the address
and WE inputs. The global signals and the EAB local interconnect can drive
the WE signal. The global signals, dedicated clock pins, and EAB local
interconnect can drive the EAB clock signals. Because the LEs drive the
EAB local interconnect, the LEs can control the WE signal or the EAB clock
signals.
Each EAB is fed by a row interconnect and can drive out to row and
column interconnects. Each EAB output can drive up to two row channels
and up to two column channels; the unused row channel can be driven by
other LEs. This feature increases the routing resources available for EAB
outputs. See Figure 4.
512
× 4
512
× 4
256
× 8
256
× 8
256
× 16
512
× 8
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EPF10K30RC208-4 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC208-4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC240-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC240-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30RC240-4 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256