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参数资料
| 型号： | EV-ADF4157SD1Z |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADF4157 |
| 标准包装： | 1 |
| 主要目的： | 计时，频率合成器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADF4157 |
| 主要属性： | 单路分数-N PLL |
| 次要属性： | 6GHz |
| 已供物品： | 板 |
ADF4157
Data Sheet
Rev. D | Page 20 of 24
LOW FREQUENCY APPLICATIONS
The specification on the RF input is 0.5 GHz minimum; however,
RF frequencies lower than this can be used, providing the mini-
mum slew rate specification of 400 V/s is met. An appropriate
LVDS driver can be used to square up the RF signal before it is
fed back to the ADF4157 RF input. The FIN1001 from Fairchild
Semiconductor is one such LVDS driver.
FILTER DESIGN—ADIsimPLL
A filter design and analysis program is available to help the user
implement PLL design. Visit www.analog.com/pll for a free
download of the ADIsimPLL software. The software designs,
simulates, and analyzes the entire PLL frequency domain and
time domain response. Various passive and active filter architec-
tures are allowed.
OPERATING WITH WIDE LOOP FILTER
BANDWIDTHS
If a wide loop filter bandwidth is used (>60 kHz), fluctuations
in the phase noise profile may be noticed on channels that are
close to integer multiples of the PFD frequency. This is due to
operation of the charge pump close to the dead zone. To improve
the phase noise, a bleed current can be enabled to bias the charge
pump away from the dead zone. To enable this, set Bit DB[24:23]
in Register 4. Using this mode has the added advantage of
improving the integer boundary spurs by 4 dB to 5 dB. Note
that it is also safe to use this mode if the loop filter bandwidth
is <60 kHz.
PCB DESIGN GUIDELINES FOR THE CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-20) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the pad.
This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board (PCB) should be
at least as large as the exposed pad. On the printed circuit
board, there should be a clearance of at least 0.25 mm between
the thermal pad and the inner edges of the pad pattern. This
ensures that shorting is avoided.
Thermal vias can be used on the PCB thermal pad to improve
thermal performance of the package. If vias are used, they should
be incorporated into the thermal pad at 1.2 mm pitch grid. The
via diameter should be between 0.3 mm and 0.33 mm, and the
via barrel should be plated with 1 ounce of copper to plug the
via. The user should connect the PCB thermal pad to AGND.
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相关代理商/技术参数 |
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| EV-ADF4159EB1Z | 制造商:Analog Devices 功能描述:EVALUATION BOARD - Boxed Product (Development Kits) 制造商:Analog Devices 功能描述:EVAL BOARD FOR ADF4159 |
| EV-ADF4159EB2Z | 制造商:Analog Devices 功能描述:13GHZFRAC-NPLL+ADF55XXVCO+3VADM - Boxed Product (Development Kits) |
| EV-ADF4159EB3Z | 制造商:Analog Devices 功能描述:EVALUATIONBOARD - Boxed Product (Development Kits) 制造商:Analog Devices 功能描述:EVAL BOARD FOR ADF4159 制造商:Analog Devices 功能描述:Clock & Timer Development Tools ADF4159 EVAL BRD |
| EV-ADF4360-0EB1Z | 功能描述:BOARD EVAL FOR ADF4360-0 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:- 标准包装:1 系列:- 主要目的:电信，线路接口单元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板，电源，线缆，CD 其它名称:82EBV2081 |
| EV-ADF4360-1EB1Z | 功能描述:BOARD EVAL FOR ADF4360-1 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:- 标准包装:1 系列:- 主要目的:电信，线路接口单元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板，电源，线缆，CD 其它名称:82EBV2081 |
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