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参数资料
| 型号： | EV-ADF4157SD1Z |
| 厂商： | Analog Devices Inc |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADF4157 |
| 标准包装： | 1 |
| 主要目的： | 计时，频率合成器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADF4157 |
| 主要属性： | 单路分数-N PLL |
| 次要属性： | 6GHz |
| 已供物品： | 板 |
Data Sheet
ADF4157
Rev. D | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, GND = AGND = DGND = 0 V, VDD = AVDD = DVDD, unless otherwise noted.
Table 3.
Parameter
Rating
AV
DD/DVDD to AGND/DGND
0.3 V to +4 V
AV
DD to DVDD
0.3 V to +0.3 V
V
P to AGND/DGND
0.3 V to +5.8 V
V
P to AVDD/DVDD
0.3 V to +5.8 V
Digital I/O Voltage to AGND/DGND
0.3 V to V
DD + 0.3 V
Analog I/O Voltage to AGND/DGND
0.3 V to V
DD + 0.3 V
REF
IN, RFINx to AGND/DGND
0.3 V to V
DD + 0.3 V
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +125°C
Maximum Junction Temperature
150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θ
JA
Unit
TSSOP
112
°C/W
LFCSP (Paddle Soldered)
30.4
°C/W
ESD CAUTION
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| EV-ADF4159EB1Z | 制造商:Analog Devices 功能描述:EVALUATION BOARD - Boxed Product (Development Kits) 制造商:Analog Devices 功能描述:EVAL BOARD FOR ADF4159 |
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| EV-ADF4159EB3Z | 制造商:Analog Devices 功能描述:EVALUATIONBOARD - Boxed Product (Development Kits) 制造商:Analog Devices 功能描述:EVAL BOARD FOR ADF4159 制造商:Analog Devices 功能描述:Clock & Timer Development Tools ADF4159 EVAL BRD |
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