参数资料
型号: EV-ADF4157SD1Z
厂商: Analog Devices Inc
文件页数: 14/24页
文件大小: 0K
描述: BOARD EVAL FOR ADF4157
标准包装: 1
主要目的: 计时,频率合成器
嵌入式:
已用 IC / 零件: ADF4157
主要属性: 单路分数-N PLL
次要属性: 6GHz
已供物品:
Data Sheet
ADF4157
Rev. D | Page 21 of 24
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 24. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-
2010-B
Figure 25. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Description
Temperature Range
Package Option
ADF4157BRUZ
16-Lead Thin Shrink Small Outline Package [TSSOP]
40°C to +85°C
RU-16
ADF4157BRUZ-RL
16-Lead Thin Shrink Small Outline Package [TSSOP]
40°C to +85°C
RU-16
ADF4157BRUZ-RL7
16-Lead Thin Shrink Small Outline Package [TSSOP]
40°C to +85°C
RU-16
ADF4157BCPZ
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
40°C to +85°C
CP-20-6
ADF4157BCPZ-RL
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
40°C to +85°C
CP-20-6
ADF4157BCPZ-RL7
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
40°C to +85°C
CP-20-6
EV-ADF4157SD1Z
Evaluation Board
1 Z = RoHS Compliant Part.
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