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参数资料
| 型号： | EVAL-AD7492SDZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD7492 |
| 标准包装： | 1 |
| 系列： | * |
AD7492
Rev. A | Page 21 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-013-AD
8°
0°
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.020)
0.31 (0.012)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
24
13
12
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
15.60 (0.6142)
15.20 (0.5984)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 34. 24-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-24)
Dimensions shown in millimeters and (inches)
24
13
12
1
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 35. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Range
Resolution (Bits)
Throughput Rate
(MSPS)
Package
Description
Package Option
AD7492AR
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492AR–REEL
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492AR–REEL7
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492ARZ1
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492ARZ–REEL1
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492ARZ–REEL71
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492BR
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492BR-REEL
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492BR–REEL7
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
40°C to +85°C
12
1
24-Lead SOIC_W
RW-24
AD7492AR-5
40°C to +85°C
12
1.25
24-Lead SOIC_W
RW-24
AD7492AR-5–REEL
40°C to +85°C
12
1.25
24-Lead SOIC_W
RW-24
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