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参数资料
| 型号： | FAN5904UC01X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 22/23页 |
| 文件大小： | 0K |
| 描述： | IC CONV BUCK W/BYPASS 16-WLCSP |
| 标准包装： | 1 |
| 应用： | 转换器，3G，3.5G，4G RF 功率放大器 |
| 输入电压： | 2.7 V ~ 5.5 V |
| 输出数： | 1 |
| 输出电压： | 0.4 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-UFBGA，WLCSP |
| 供应商设备封装： | 16-WLCSP |
| 包装： | 标准包装 |
| 其它名称： | FAN5904UC01XFSDKR |
Physical Dimensions
2X
0.03 C
E
A
B
F
A1
0.40
(?0.20)
Cu Pad
BALL A1
INDEX AREA
D
0.03 C
0.40
(?0.30) Solder
Mask Opening
2X
RECOMMENDED LAND PATTERN
TOP VIEW
0.06 C
(NSMD PAD TYPE)
0.05 C
0.625
0.547
E
0.378±0.018
0.208±0.021
C
SEATING
PLANE
D
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
C A B
B. DIMENSIONS ARE IN MILLIMETERS.
0.40
D
C
?0.260±0.02
16X
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
0.40
1 2 3 4
B
A
(Y) ±0.018
F
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
(X) ±0.018
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC016AArev2.
Product
FAN5904UC00X
FAN5904UC01X
D
1.710 ±0.030
1.710 ±0.030
E
1.710 ±0.030
1.710 ±0.030
X
0.255
0.255
Y
0.255
0.255
Unit
mm
mm
Figure 60. 1.71x1.71 mm Square, 16 Bumps, 0.4 mm Pitch, WLCSP
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
? 2011 Fairchild Semiconductor Corporation
FAN5904 ? Rev. 3.0.7
22
www.fairchildsemi.com
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