参数资料
型号: FAN5904UC01X
厂商: Fairchild Semiconductor
文件页数: 4/23页
文件大小: 0K
描述: IC CONV BUCK W/BYPASS 16-WLCSP
标准包装: 1
应用: 转换器,3G,3.5G,4G RF 功率放大器
输入电压: 2.7 V ~ 5.5 V
输出数: 1
输出电压: 0.4 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-UFBGA,WLCSP
供应商设备封装: 16-WLCSP
包装: 标准包装
其它名称: FAN5904UC01XFSDKR
Absolute Maximum Ratings
Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
V IN
T J
T STG
T L
Parameter
Voltage on AVIN, PVIN
Voltage on Any Other Pin
Junction Temperature
Storage Temperature
Lead Soldering Temperature (10 Seconds)
Min.
-0.3
-0.3
-40
-65
Max.
6.0
AV IN + 0.3
+125
+150
+260
Unit
V
°C
°C
°C
ESD
Electrostatic Discharge Protection Level
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
2.0
1.0
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to Absolute Maximum Ratings.
Symbol
V IN
V OUT
I OUT_BYP
Parameter
Supply Voltage Range
Output Voltage Range
Output Current (Bypass Mode)
Min.
2.7
0.35
Typ.
Max.
5.5
<V IN
3.0
Unit
V
V
A
I OUT_LP_MODE Output Current (Low-Power Mode)
I OUT_HP_MODE Output Current (High-Power Mode)
1.2
2.3
A
A
L
Inductor for Smallest PCB Footprint
Inductor for Optimum Efficiency Performance
470
1.0
nH
μH
C IN
Input Capacitor
(1)
10
μF
C OUT
Output Capacitor
2 x 4.7
μF
T A
T J
Operating Ambient Temperature Range
Operating Junction Temperature Range
-40
-40
+85
+125
°C
°C
Note:
1. A large enough input capacitor value is required for limiting the input voltage drop during GSM bursts, bypass transitions,
or during large output voltage transitions.
Dissipation Ratings
Junction-to-Ambient Thermal Resistance
Symbol
Θ JA
Parameter
(2)
Min.
Typ.
80
Max.
Unit
°C/W
Note:
2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction
temperature T J(MAX) at a given ambient temperate T A .
? 2011 Fairchild Semiconductor Corporation
FAN5904 ? Rev. 3.0.7
4
www.fairchildsemi.com
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