参数资料
型号: FDB12N50TM
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH 500V 11.5A D2PAK
产品目录绘图: D2PAK, TO-263AB Pkg
标准包装: 1
系列: UniFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 500V
电流 - 连续漏极(Id) @ 25° C: 11.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 650 毫欧 @ 6A,10V
Id 时的 Vgs(th)(最大): 5V @ 250µA
闸电荷(Qg) @ Vgs: 30nC @ 10V
输入电容 (Ciss) @ Vds: 1315pF @ 25V
功率 - 最大: 165W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D²PAK
包装: 标准包装
其它名称: FDB12N50TMDKR
November 2013
FDB12N50TM
N-Channel UniFET TM MOSFET
500 V, 11.5 A, 650 m ?
Features
? R DS(on) = 550 m ? (Typ.) @ V GS = 10 V, I D = 6 A
? Low Gate Charge (Typ. 22 nC)
? Low C rss (Typ. 12 pF)
? 100% Avalanche Tested
? RoHS Compliant
Applications
Description
UniFET TM MOSFET is Fairchild Semiconductor ’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
? Lighting
? Uninterruptible Power Supply
? AC-DC Power Supply
D
D
G
S
D 2 -PAK
G
S
MOSFET Maximum Ratings T C = 25 o C unless otherwise noted.
Symbol
V DSS
Drain to Source Voltage
Parameter
FDB12N50TM
500
Unit
V
V GSS
I D
Gate to Source Voltage
Drain Current
- Continuous (T C = 25 o C)
- Continuous (T C = 100 o C)
±30
11.5
6.9
V
A
I DM
Drain Current
- Pulsed
(Note 1)
46
A
E AS
I AR
E AR
dv/dt
P D
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(T C = 25 o C)
- Derate above 25 o C
(Note 2)
(Note 1)
(Note 1)
(Note 3)
456
11.5
16.7
4.5
165
1.33
mJ
A
mJ
V/ns
W
W/ o C
T J , T STG
T L
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
-55 to +150
300
o
o
C
C
Thermal Characteristics
Symbol
R ? JC
Parameter
Thermal Resistance, Junction to Case, Max
FDB12N50TM
0.75
Unit
R ? JA
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max.
Thermal Resistance, Junction to Ambient (1 in 2 pad of 2 oz copper), Max.
62.5
40
o
C/W
?2007 Fairchild Semiconductor Corporation
FDB12N50TM Rev. C1
1
www.fairchildsemi.com
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