参数资料
型号: FDC638APZ
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET P-CH 20V 4.5A SSOT-6
产品变化通告: Mold Compound Change 08/April/2008
产品目录绘图: MOSFET SuperSOT-6
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 4.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 43 毫欧 @ 4.5A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 12nC @ 4.5V
输入电容 (Ciss) @ Vds: 1000pF @ 10V
功率 - 最大: 800mW
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: 6-SSOT
包装: 标准包装
产品目录页面: 1603 (CN2011-ZH PDF)
其它名称: FDC638APZDKR
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
? BV DS S
? T J
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
I D = –250 μ A, V GS = 0V
I D = –250 μ A, referenced to 25°C
–20
–9.4
V
mV/° C
I DSS
I GSS
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
V DS = –16V,
V GS = 0V
V GS = ±12V, V DS = 0V
T J = 55°C
–1
–10
±10
μ A
μ A
On Characteristics
V GS(th)
? V GS(th)
? T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = –250 μ A
I D = –250 μ A, referenced to 25°C
–0.4
–0.8
2.9
–1.5
V
mV/°C
V GS = –4.5V, I D = –4.5A
37
4 3
r DS(on)
Static Drain to Source On Resistance
V GS = –2.5V, I D = –3.8A
52
6 8
m ?
V GS = –4.5V, I D = –4.5A, T J = 125°C
50
72
I D(on)
g FS
On-State Drain Current
Forward Transconductance
V GS = –10V, V DS = –4.5A
V DS = –10V, I D = –4.5A
–20
18
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –10V, V GS = 0V,
f = 1MHz
750
155
130
1000
210
195
pF
pF
pF
Switching Characteristics (Note 2)
t d(on)
t r
t d(off)
t f
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
V DD = –5V, I D = –4.5A
V GS = –4.5V, R GEN = 6 ?
6
20
48
4 7
12
3 1
77
72
ns
n s
ns
ns
Q g(TOT)
Q gs
Total Gate Charge
Gate to Source Gate Charge
V GS = 0V to –4.5V
V DD = –5V
I D = –4.5A
8
2
12
nC
nC
Q gd
Gate to Drain “Miller” Charge
2
nC
Drain-Source Diode Characteristics
I S
Maximum Continuous Drain-Source Diode Forward Current
–1.3
A
V SD
Source to Drain Diode Forward Voltage V GS = 0V, I S = –1.3A
(Note 2)
–0.8
–1.2
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = –4.5A, di/dt = 100A/ μ s
24
13
36
20
ns
nC
Notes:
1: R θ JA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θ JC is
guaranteed by design while R θ CA is determined by user’s board design.
a. 78°C/W when mounted on
a 1 in 2 pad of 2 oz copper on
FR-4 board.
2: Pulse Test: Pulse Width < 30 0 μ s, Duty cycle < 2.0%.
b. 156°C/W when mounted on a
minimum pad of 2 oz copper.
FDC638APZ Rev.B
2
www.fairchildsemi.com
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