参数资料
型号: FDD3N50NZTM
厂商: Fairchild Semiconductor
文件页数: 4/8页
文件大小: 0K
描述: MOSFET N-CH 500V DPAK
标准包装: 2,500
系列: UniFET-II™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 500V
电流 - 连续漏极(Id) @ 25° C: 2.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.5 欧姆 @ 1.25A,10V
Id 时的 Vgs(th)(最大): 5V @ 250µA
闸电荷(Qg) @ Vgs: 8nC @ 10V
输入电容 (Ciss) @ Vds: 280pF @ 25V
功率 - 最大: 40W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
1.15
Figure 8. On-Resistance Variation
vs. Temperature
2.6
2.4
1.10
2.0
1.05
1.00
1.6
1.2
T J , Junction Temperature [ C ]
T J , Junction Temperature [ C ]
0.95
0.90
-75 -50
*Notes:
1. V GS = 0V
2. I D = 250 μ A
0 50 100 150
o
0.8
0.4
-75 -50
*Notes:
1. V GS = 10V
2. I D = 1.25A
0 50 100 150
o
Figure 9. Maximum Safe Operating Area
20
Figure 10. Maximum Drain Current
vs. Case Temperature
3.0
10
100 μ s
30 μ s
2.5
1
Operation in This Area
is Limited by R DS(on)
1ms
10ms
DC
2.0
1.5
1. T C = 25 C
2. T J = 150 C
0.1
*Notes:
o
o
1.0
0.5
T C , Case Temperature [ C ]
0.01
1
3. Single Pulse
10 100
V DS , Drain-Source Voltage [V]
800
0.0
25
50 75 100 125
o
150
Figure 11. Transient Thermal Response Curve
4
0.5
1
0.2
1. Z θ JC (t) = 3.1 C/W Max.
0.1
0.1
0.05
0.02
0.01
Single pulse
P DM
t 1
t 2
*Notes:
o
2. Duty Factor, D= t 1 /t 2
10
10
10
10
10
0.01
-5
-4
-3
-2
3. T JM - T C = P DM * Z θ JC (t)
-1
1
1 ,
t Rectangular Pulse Duration [sec]
?2011 Fairchild Semiconductor Corporation
FDD3N50NZ Rev. C1
4
www.fairchildsemi.com
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