参数资料
型号: FDD6635
厂商: Fairchild Semiconductor
文件页数: 3/8页
文件大小: 0K
描述: MOSFET N-CH 35V 15A DPAK
产品目录绘图: DPAK, TO-252(AA)
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 35V
电流 - 连续漏极(Id) @ 25° C: 15A
开态Rds(最大)@ Id, Vgs @ 25° C: 10 毫欧 @ 15A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 36nC @ 10V
输入电容 (Ciss) @ Vds: 1400pF @ 20V
功率 - 最大: 1.6W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: TO-252
包装: 标准包装
产品目录页面: 1605 (CN2011-ZH PDF)
其它名称: FDD6635DKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ
Max Units
Drain–Source Diode Characteristics
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = 15 A
(Note 2)
0.8
1.2
V
Voltage
trr
Qrr
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
IF = 15 A,
diF/dt = 100 A/μs
26
16
ns
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) R θ JA = 40°C/W when mounted on a
1in 2 pad of 2 oz copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
P D
b) R θ JA = 96°C/W when mounted
on a minimum pad.
3. Maximum current is calculated as:
R DS(ON)
where P D is maximum power dissipation at T C = 25°C and R DS(on) is at T J(max) and V GS = 10V. Package current limitation is 21A
4. BV(avalanche) Single-Pulse rating is guaranteed if device is operated within the UIS SOA boundary of the device.
5. Starting T J = 25°C, L = 1mH, I AS = 15A, V DD = 35V, V GS = 10V
FDD6635 Rev. C2(W)
www.fairchildsemi.com
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