参数资料
型号: FDD6N20TM
厂商: Fairchild Semiconductor
文件页数: 4/8页
文件大小: 0K
描述: MOSFET N-CH 200V 4.5A DPAK
产品目录绘图: DPAK, TO-252(AA)
标准包装: 1
系列: UniFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 200V
电流 - 连续漏极(Id) @ 25° C: 4.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 800 毫欧 @ 2.3A,10V
Id 时的 Vgs(th)(最大): 5V @ 250µA
闸电荷(Qg) @ Vgs: 6.1nC @ 10V
输入电容 (Ciss) @ Vds: 230pF @ 25V
功率 - 最大: 40W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 标准包装
产品目录页面: 1606 (CN2011-ZH PDF)
其它名称: FDD6N20TMDKR
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
1.2
Figure 8. On-Resistance Variation
vs. Temperature
3.0
2.5
1.1
2.0
1.0
1.5
1.0
0.9
T J , Junction Temperature [ C ]
T J , Junction Temperature [ C ]
0.8
-100
*Notes:
1. V GS = 0V
2. I D = 250 μ A
-50 0 50 100 150 200
o
0.5
0.0
-100
*Notes:
1. V GS = 10V
2. I D = 2.3A
-50 0 50 100 150 200
o
Figure 9. Maximum Safe Operating Area
50
20 μ s
Figure 10. Maximum Drain Current
vs. Case Temperature
5
10
100 μ s
4
1. T C = 25 C
1
0.1
Operation in This Area
is Limited by R DS(on)
*Notes:
o
1ms
10ms
DC
3
2
1
2. T J = 150 C
o
T C , Case Temperature [ C ]
0.01
1
3. Single Pulse
10 100
V DS , Drain-Source Voltage [V]
400
0
25
50 75 100 125
o
150
Figure 11. Transient Thermal Response Curve
5
0.5
1
0.2
0.1
P DM
0.1
0.05
0.02
t 1
t 2
1. Z θ JC (t) = 3.1 C/W Max.
0.01
Single pulse
*Notes:
o
2. Duty Factor, D=t 1 /t 2
10
10
10
10
10
10
10
0.01
-5
-4
-3
-2
3. T JM - T C = P DM * Z θ JC (t)
-1 0
1
1 ,
t Rectangular Pulse Duration [sec]
?2007 Fairchild Semiconductor Corporation
FDD6N20TM Rev. C1
4
www.fairchildsemi.com
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