参数资料
型号: FDG315N
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 30V 2A SC70-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2A
开态Rds(最大)@ Id, Vgs @ 25° C: 120 毫欧 @ 2A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 4nC @ 5V
输入电容 (Ciss) @ Vds: 220pF @ 15V
功率 - 最大: 480mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 标准包装
其它名称: FDG315NDKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
? BV DSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
V GS = 0 V, I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
30
26
V
mV/ ° C
? T J
Coefficient
I DSS
I GSS
I GSS
Zero Gate Voltage Drain Current
Gate-Body Leakage Forward
Gate-Body Leakage Reverse
V DS = 24 V, V GS = 0 V
V GS = 16 V, V DS = 0 V
V GS = -16 V, V DS = 0 V
1
100
-100
μ A
nA
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
Gate Threshold Voltage
Gate Threshold Voltage
V DS = V GS , I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
1
1.8
-4
3
V
mV/ ° C
? T J
Temperature Coefficient
R DS(on)
Static Drain-Source
On-Resistance
V GS = 10 V, I D = 2 A
V GS = 10 V, I D = 2 A, T J = 125 ° C
0.100
0.140
0.12
0.20
?
V GS = 4.5 V, I D = 1.7 A
0.130
0.16
I D(on)
G FS
On-State Drain Current
Forward Transconductance
V GS = 4.5 V, V DS = 5 V
V DS = 5 V, I D = 2 A
3
5
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 15 V, V GS = 0 V,
f = 1.0 MHz
220
50
20
pF
pF
pF
Switching Characteristics
(Note 2)
I d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 15 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V DS = 15 V, I D = 2 A,
V GS = 5 V
3
11
7
3
2.1
0.8
0.7
6
22
14
6
4
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain-Source Diode Forward Current
0.42
A
V SD
Drain-Source Diode Forward
V GS = 0 V, I S = 0.42 A
(Note 2)
0.7
1.2
V
Voltage
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 170 ° C/W when mounted on a 1 in 2 pad of 2oz copper.
b) 260 ° C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDG315N Rev. C
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