参数资料
型号: FDG327NZ
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 20V 1.5A SC70-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 1.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 90 毫欧 @ 1.5A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 6nC @ 4.5V
输入电容 (Ciss) @ Vds: 412pF @ 10V
功率 - 最大: 380mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 标准包装
其它名称: FDG327NZFSDKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ
Max
Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage
V GS = 0 V,
I D = 250 μ A
20
V
? BV DSS
? T J
Breakdown Voltage Temperature
Coefficient
I D = 250 μ A, Referenced to 25 ° C
11
mV/ ° C
I DSS
I GSS
Zero Gate Voltage Drain Current
Gate–Body Leakage
V DS = 16 V,
V GS = ± 8 V,
V GS = 0 V
V DS = 0 V
1
± 10
μ A
μ A
On Characteristics
(Note 2)
V GS(th)
Gate Threshold Voltage
V DS = V GS ,
I D = 250 μ A
0.4
0.7
1.5
V
? V GS(th)
? T J
Gate Threshold Voltage
Temperature Coefficient
ID = 250 μ A, Referenced to 25 ° C
–2
mV/ ° C
R DS(on)
Static Drain–Source
On–Resistance
V GS = 4.5 V, I D = 1.5 A
V GS = 2.5 V, I D = 1.4 A
V GS = 1.8 V, I D = 1.2 A
V GS = 4.5 V, I D = 1.5 A, T J =125 ° C
68
77
90
86
90
100
140
123
m ?
I D(on)
g FS
On–State Drain Current
Forward Transconductance
V GS = 4.5V,
V DS = 10 V,
V DS = 5 V
I D = 1.5 A
3
2.2
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 10 V,
f = 1.0 MHz
V GS = 0 V
412
81
44
pF
pF
pF
R G
Gate Resistance
V GS = 15 mV, f = 1.0 MHz
1.9
?
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
V DD = 10 V,
V GS = 4.5 V,
V DS = 10 V,
V GS = 4.5 V
I D = 1 A,
R GEN = 6 ?
I D = 1.5 A,
6.2
2.3
18
2.9
4.2
0.4
13
10
33
10
6
ns
ns
n s
ns
nC
nC
Q gd
Gate–Drain Charge
1
nC
Drain–Source Diode Characteristics and Maximum Ratings
V SD
Drain–Source Diode Forward
Voltage
V GS = 0 V,
I S = 0.32 A
(Note 2)
0.6
1.2
V
t rr
Q rr
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
I F = 1.5 A,
d iF /d t = 100 A/μs
4
2
nS
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a)
300°C/W when
mounted on a 1in 2 pad
of 2 oz copper.
b)
333°C/W when mounted
on a minimum pad of 2 oz
copper.
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
FDG327NZ Rev C 1 (W)
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FDG329N 功能描述:MOSFET 20V N-Ch PowerTrench RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube