参数资料
型号: FDG6318P
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET P-CH DUAL 20V SC70-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
标准包装: 1
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 500mA
开态Rds(最大)@ Id, Vgs @ 25° C: 780 毫欧 @ 500mA,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 1.2nC @ 4.5V
输入电容 (Ciss) @ Vds: 83pF @ 10V
功率 - 最大: 300mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 标准包装
其它名称: FDG6318PFSDKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
Drain–Source Breakdown
V GS = 0 V,
I D = –250 μ A
–20
V
Voltage
? BV DSS
? T J
I DSS
I GSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage
I D = –250 μ A, Referenced to 25 ° C
V DS = –16 V, V GS = 0 V
V GS = ± 12 V, V DS = 0 V
–10
–1
± 100
mV/ ° C
μ A
nA
On Characteristics
(Note 2)
V GS(th)
Gate Threshold Voltage
V DS = V GS ,
I D = –250 μ A
–0.65
–1.2
–1.5
V
? V GS(th)
? T J
Gate Threshold Voltage
Temperature Coefficient
I D = –250 μ A, Referenced to 25 ° C
2
mV/ ° C
R DS(on)
Static Drain–Source
On–Resistance
V GS = –4.5 V,
V GS = –2.5 V,
I D = –0.5 A
I D = –0.4 A
580
980
780
1200
m ?
V GS = –4.5 V,
I D = –0.5 A, T J =125°C
780
I D(on)
g FS
On–State Drain Current
Forward Transconductance
V GS = –4.5 V,
V DS = –5 V,
V DS = –5 V
I D = –0.5 A
–1.8
1.1
A
S
Dynamic Characteristics
C iss
C oss
C rss
R G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = –10 V, V GS = 0 V,
f = 1.0 MHz
V GS = 15 mV, f = 1.0 MHz
83
20
11
12.1
pF
pF
pF
?
Switchin g Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V DD = –10 V, I D = 1 A,
V GS = –4.5 V, R GEN = 6 ?
V DS = –10 V, I D = –0.6 A,
V GS = –4.5 V
6
12
6
1
0.86
0.22
0.25
12
22
13
3
1.2
ns
ns
ns
ns
nC
nC
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
–0.25
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = –0.25 A (Note 2)
–0.83
–1.2
V
Voltage
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = –0.5 A,
d iF /d t = 100 A/μs
12.6
2.52
ns
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ JA is determined by the user's board design. R θ JA = 415°C/W when mounted on a minimum pad .
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
FDG6318P Rev C (W)
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