参数资料
型号: FDMS3008SDC
厂商: Fairchild Semiconductor
文件页数: 3/9页
文件大小: 0K
描述: MOSFET N-CH 30V 29A 8-PQFN
标准包装: 3,000
系列: Dual Cool™, PowerTrench®, SyncFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 29A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.6 毫欧 @ 28A,10V
Id 时的 Vgs(th)(最大): 3V @ 1mA
闸电荷(Qg) @ Vgs: 64nC @ 10V
输入电容 (Ciss) @ Vds: 4520pF @ 15V
功率 - 最大: 3.3W
安装类型: 表面贴装
封装/外壳: 8-PowerTDFN
供应商设备封装: Power56
包装: *
Thermal Characteristics
R θ JC
R θ JC
R θ JA
R θ JA
R θ JA
R θ JA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Top Source)
(Bottom Drain)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
3.5
1.6
38
81
27
34
R θ JA
R θ JA
R θ JA
R θ JA
R θ JA
R θ JA
R θ JA
R θ JA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1e)
(Note 1f)
(Note 1g)
(Note 1h)
(Note 1i)
(Note 1j)
(Note 1k)
(Note 1l)
16
19
26
61
16
23
11
13
°C/W
NOTES:
1. R θ JA is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R θ JC is guaranteed by design while R θ CA is determined
by the user's board design.
a. 38 °C/W when mounted on
a 1 in 2 pad of 2 oz copper
b. 81 °C/W when mounted on
a minimum pad of 2 oz copper
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in 2 pad of 2 oz copper
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in 2 pad of 2 oz copper
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in 2 pad of 2 oz copper
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in 2 pad of 2 oz copper
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in 2 pad of 2 oz copper
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300 μ s, Duty cycle < 2.0%.
3. E AS of 112 mJ is based on starting T J = 25 ° C, L = 1 mH, I AS = 15 A, V DD = 27 V, V GS = 10 V. 100% test at L = 0.1 mH, I AS = 33.4 A.
?2012 Fairchild Semiconductor Corporation
FDMS3008SDC Rev.C4
3
www.fairchildsemi.com
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