参数资料
型号: FDMS3668S
厂商: Fairchild Semiconductor
文件页数: 1/16页
文件大小: 0K
描述: MOSFET N-CH 30V DUAL 8-PQFN
标准包装: 3,000
系列: PowerTrench®
FET 型: 2 N 沟道(双)非对称型
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 13A,18A
开态Rds(最大)@ Id, Vgs @ 25° C: 8 毫欧 @ 13A,10V
Id 时的 Vgs(th)(最大): 2.7V @ 250µA
闸电荷(Qg) @ Vgs: 29nC @ 10V
输入电容 (Ciss) @ Vds: 1765pF @ 15V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-TDFN 裸露焊盘
供应商设备封装: 8-PQFN(5x6)
包装: 带卷 (TR)
FDMS3668S
PowerTrench ? Power Stage
Asymmetric Dual N-Channel MOSFET
Features
Q1: N-Channel
Max r DS(on) = 8 m Ω at V GS = 10 V, I D = 13 A
Max r DS(on) = 11 m Ω at V GS = 4.5 V, I D = 11 A
Q2: N-Channel
Max r DS(on) = 5 m Ω at V GS = 10 V, I D = 18 A
Max r DS(on) = 5.2 m Ω at V GS = 4.5 V, I D = 17 A
Low inductance packaging shortens rise/fall times, resulting in
lower switching losses
MOSFET integration enables optimum layout for lower circuit
inductance and reduced switch node ringing
RoHS Compliant
Pin 1
G1
December 2012
General Description
This device includes two specialized N-Channel MOSFETs in a
dual PQFN package. The switch node has been internally
connected to enable easy placement and routing of synchronous
buck converters. The control MOSFET (Q1) and synchronous
SyncFET TM (Q2) have been designed to provide optimal power
efficiency.
Applications
Computing
Communications
General Purpose Point of Load
Notebook VCORE
Pin 1
D1
D1
D1
D1
S2
5
Q2
4 D1
PHASE
S2
6
PHASE
3 D1
(S1/D2)
G2
S2
7
2 D1
S2
S2
S2
G2
8
Q1
1 G1
Top
Power 56
Bottom
MOSFET Maximum Ratings T A = 25 °C unless otherwise noted
Symbol
V DS
Drain to Source Voltage
Parameter
Q1
30
Q2
30
Units
V
V GS
I D
Gate to Source Voltage
Drain Current
-Continuous (Package limited)
-Continuous (Silicon limited)
-Continuous
(Note 3)
T C = 25 °C
T C = 25 °C
T A = 25 °C
±20
30
60
13 1a
±12
60
77
18 1b
V
A
-Pulsed
40
60
E AS
Single Pulse Avalanche Energy
33 4
21 5
mJ
P D
Power Dissipation for Single Operation
Power Dissipation for Single Operation
T A = 25 °C
T A = 25 °C
2.2 1a
1 1c
2.5 1b
1 1d
W
T J , T STG
Operating and Storage Junction Temperature Range
-55 to +150
°C
Thermal Characteristics
R θ JA
Thermal Resistance, Junction to Ambient
57 1a
50 1b
R θ JA
R θ JC
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
125 1c
2.9
120 1d
2.8
°C/W
Package Marking and Ordering Information
Device Marking
22CF
21CD
Device
FDMS3668S
Package
Power 56
Reel Size
13 ”
Tape Width
12 mm
Quantity
3000 units
?2012 Fairchild Semiconductor Corporation
FDMS3668S Rev.C3
1
www.fairchildsemi.com
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