参数资料
型号: FDS6681Z
厂商: Fairchild Semiconductor
文件页数: 5/6页
文件大小: 0K
描述: MOSFET P-CH 30V 20A SO-8
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
产品目录绘图: Power MOSFET, 8-SOP, SO-8
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 20A
开态Rds(最大)@ Id, Vgs @ 25° C: 4.6 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 260nC @ 10V
输入电容 (Ciss) @ Vds: 7540pF @ 15V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: SO-8
包装: 标准包装
产品目录页面: 1604 (CN2011-ZH PDF)
其它名称: FDS6681ZDKR
Typical Characteristics
10
8
I D = -20A
10000
8000
C iss
f = 1MHz
V GS = 0 V
6
4
2
0
V DS = -10V
-15V
-20V
6000
4000
2000
0
C rss
C oss
0
40
80 120
160
200
0
5
10 15 20 25
30
1000
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
50
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
SINGLE PULSE
100
R DS(ON) LIMIT
100us
40
R θ JA = 125°C/W
T A = 25°C
1ms
T A = 25 C
10
1
0.1
0.01
V GS = -10V
SINGLE PULSE
R θ JA = 125 o C/W
o
DC
10s
1s
10ms
100ms
30
20
10
0
0.01
0.1 1 10
100
0.001
0.01
0.1
1
10
100
1000
-V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area.
t 1 , TIME (sec)
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
0.2
R θ JA (t) = r(t) * R JA
R θ JA = 125 °C/W
0.1
0.1
0.05
P(pk
0.01
0.001
0.02
0.01
SINGLE PULSE
t 1
t 2
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 / t 2
0.0001
0.001
0.01
0.1
1
10
100
1000
t 1 , TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDS6681Z Rev B (W)
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