参数资料
型号: FDS6912
厂商: Fairchild Semiconductor
文件页数: 4/5页
文件大小: 0K
描述: MOSFET N-CH DUAL PWM OPT 8-SOIC
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 2,500
系列: PowerTrench®
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6A
开态Rds(最大)@ Id, Vgs @ 25° C: 28 毫欧 @ 6A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 5V
输入电容 (Ciss) @ Vds: 740pF @ 15V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
Typical Characteristics (continued)
10
2000
I D = 6.3A
V DS = 5V
10V
8
15V
1000
C iss
6
500
4
C oss
2
200
f = 1 MHz
V GS = 0V
C rss
0
0
4
8
12
16
80
0.1
0.3
1
3
10
30
100
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
30
V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
S(O
LIM
100
1m
10m
20
10
RD
N)
IT
s
s
us
25
20
SINGLE PULSE
R θ JA = 135°C/W
T A = 25°
10
2
0.5
V GS = 10V
DC
1 0 0
1s
s
ms
15
10
SINGLE PULSE
0.05
R θ JA = 135 °C/W
T A = 25°C
5
0.01
0.1
0.2
0.5
V
DS
1 2 5 10
, DRAIN-SOURCE VOLTAGE (V)
20
0
0.01
0.1
1 10
SINGLE PULSE TIME (SEC)
100
1000
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
1
0.5
D = 0.5
0.2
0.1
0.05
0.02
0.2
0.1
0.05
0.02
0.01
R θ JA (t) = r(t) * R θ JA
R θ JA = 135°C/W
P(pk)
0.01
Single Pulse
t 1
t 2
0.005
0.002
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 /t 2
0.001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDS6912 Rev E (W)
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