参数资料
型号: FDS6930B
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH DUAL 30V 5.5A 8-SOIC
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 5.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 38 毫欧 @ 5.5A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 3.8nC @ 5V
输入电容 (Ciss) @ Vds: 412pF @ 15V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 标准包装
产品目录页面: 1603 (CN2011-ZH PDF)
其它名称: FDS6930BDKR
Electrical Characteristics T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
? BV DSS
? T J
I DSS
I GSS
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coef?cient
Zero Gate Voltage Drain Current
Gate–Source Leakage
V GS = 0 V, I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
V DS = 24 V, V GS = 0 V
V DS = 24 V, V GS = 0 V, T J = 55 ° C
V GS = ± 20 V, V DS = 0 V
30
26
1
10
± 100
V
mV/ ° C
μ A
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
? T J
R DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coef?cient
Static Drain–Source
V DS = V GS , I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
V GS = 10 V, I D = 5.5 A
1
1.9
–4.6
31
3
38
V
mV/ ° C
m ?
On–Resistance
V GS = 4.5 V, I D = 4.8 A
V GS = 10 V, I D = 5.5 A, T J = 125 ° C
40
45
50
62
I D(on)
g FS
On–State Drain Current
Forward Transconductance
V GS = 10 V, V DS = 5 V
V DS = 5 V, I D = 5.5 A
20
19
A
S
Dynamic Characteristics
C iss
C oss
C rss
R G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 15 V, V GS = 0 V,
f = 1.0 MHz
V GS = 15 mV, f = 1.0 MHz
310
90
40
1.9
412
120
60
pF
pF
pF
?
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V DD = 15 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V DS = 15 V, I D = 5.5 A,
V GS = 5 V
6
6
16
2
2.7
1.0
0.7
12
12
28
4
3.8
ns
ns
ns
ns
nC
nC
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
1.3
A
V SD
t rr
Q rr
Drain–Source Diode Forward Voltage
Diode Reverse Recovery Time (note3)
Diode Reverse Recovery Charge
V GS = 0 V, I S = 1.3 A (Note 2)
I F = 5.5 A, d iF /d t = 100 A/μs
0.8
16
6
1.2
32
V
nS
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is de?ned as the solder mounting surface of the drain pins.
R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 78°C/W when mounted
on a 0.5 in 2 pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
3. Trr parameter will not be subjected to 100% production testing.
FDS6930B Rev. A1
2
b) 125°C/W when
mounted on a 0.02 in 2
pad of 2 oz copper
c) 135°C/W when
mounted on a
minimum pad.
www.fairchildsemi.com
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