参数资料
型号: FDZ191P
厂商: Fairchild Semiconductor
文件页数: 2/7页
文件大小: 0K
描述: MOSFET P-CH 20V 3A 6WLCSP
产品培训模块: High Voltage Switches for Power Processing
产品目录绘图: 6-WL-CSP Package
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3A
开态Rds(最大)@ Id, Vgs @ 25° C: 85 毫欧 @ 1A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 13nC @ 10V
输入电容 (Ciss) @ Vds: 800pF @ 10V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 6-UFBGA,WLCSP
供应商设备封装: 6-WLCSP
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDZ191PDKR
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
' BV DS S
' T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = -250 P A, V GS = 0V
I D = -250 P A, referenced to 25°C
V DS = -16V, V GS = 0V
V GS = ±8V, V DS = 0V
-20
-12
-1
±100
V
mV/° C
P A
nA
On Characteristics
V GS(th)
' V GS(th )
' T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = -250 P A
I D = -250 P A, referenced to 25°C
-0.4
-0.6
2
-1.5
V
mV/°C
V GS = -4.5V, I D = -1A
67
85
r DS(on)
Drain to Source On Resistance
V GS = -2.5V, I D = -1A
V GS = -1.5V, I D = -1A
85
140
123
200
m :
V GS = -4.5V, I D = -1A T J = 125°C
87
123
I D(on)
g FS
On to State Drain Current
Forward Transconductance
V GS = -4.5V, V DS = -5V
V DS = -5V, I D = -1A
-10
7
A
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = -10V, V GS = 0V,
f = 1MHz
f = 1MHz
800
155
90
9
pF
pF
pF
:
Switching Characteristics
t d(on)
t r
t d(off)
t f
Q g(TOT)
Q gs
Q gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
V DD = -10V, I D = -1A
V GS = -4.5V, R GEN = 6 :
V GS = 0V to 10V V DD = -10V
I D = -1A
11
10
50
30
9
1
2
20
20
80
48
13
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics
I S
Maximum continuous Drain-Source Diode Forward Current
-1.1
A
V SD
Source to Drain Diode Forward Voltage
V GS = 0V, I S = -1.1A
(Note 2)
-0.7
-1.2
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = -1A, di/dt = 100A/ P s
21
5
ns
nC
Notes:
1: R T JA is determined with the device mounted on a 1in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. The thermal resistance from the junction to the circuit board
side of the solder ball, R T JB is defined for reference. For R T JC the thermal reference point for the case is defined as the top surface of the copper chip carrier. R T JC and R T JB
are guaranteed by design while R T JA is determined by the user's board design.
a. 65°C/W when mounted on
a 1 in 2 pad of 2 oz copper,1.5”
X 1.5” X 0.062” thick PCB
2: Pulse Test: Pulse Width < 30 0 P s, Duty cycle < 2.0%.
b. 133°C/W when mounted on a
minimum pad of 2 oz copper
FDZ191P Rev.F3(W)
2
www.fairchildsemi.com
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