参数资料
型号: FGA50N100BNTD2
厂商: Fairchild Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: IGBT NPT 1000V 50A TO-3P
产品目录绘图: FGA Series TO-3P
标准包装: 30
IGBT 类型: NPT 和沟道
电压 - 集电极发射极击穿(最大): 1000V
Vge, Ic时的最大Vce(开): 2.9V @ 15V,60A
电流 - 集电极 (Ic)(最大): 50A
功率 - 最大: 156W
输入类型: 标准
安装类型: 通孔
封装/外壳: TO-3P-3,SC-65-3
供应商设备封装: TO-3PN
包装: 管件
产品目录页面: 1610 (CN2011-ZH PDF)
November 2013
FGA50N100BNTD2
1000 V NPT Trench IGBT
Features
General Description
?
?
?
?
?
High Speed Switching
Low Saturation Voltage : V CE(sat) = 2.5 V @ I C = 60 A
High Input Impedance
Built-in Fast Recovery Diode
RoHS Compliant
Using Fairchild's proprietary trench design and advanced NPT
technology, the 1000V NPT IGBT offers superior conduction
and switching performances, high avalanche ruggedness and
easy parallel operation. This device offers the optimum perfor-
mance for hard switching application such as UPS, welder
Applications
applications.
? UPS, Welder
C
G
TO-3P
G C E
Absolute Maximum Ratings
E
Symbol
V CES
V GES
Description
Collector to Emitter Voltage
Gate to Emitter Voltage
Ratings
1000
± 25
Unit
V
V
@ T C = 100 C
@ T C = 100 C
I C
I CM (1)
I F
I FM
P D
Collector Current
Collector Current
Pulsed Collector Current
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Maximum Power Dissipation
Maximum Power Dissipation
@ T C = 25 o C
o
@ T C = 25 o C
@ T C = 100 o C
@ T C = 25 o C
o
50
35
200
30
15
150
156
63
A
A
A
A
A
A
W
W
T J
T stg
T L
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
-55 to +150
-55 to +150
300
o
o
o
C
C
C
Notes:
1: Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
Unit
R ? JC (IGBT)
R ? JC (DIODE)
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
-
-
0.8
1.2
o
o
C / W
C / W
R ? JA
Thermal Resistance, Junction to Ambient
-
40.0
o C / W
?2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
1
www.fairchildsemi.com
相关PDF资料
PDF描述
FGA50N100BNTDTU IGBT NPT 50A 1000V TO-3P
FGA50N100BNTTU IGBT NPT 1000V 50A TO-3P
FGA60N60UFDTU IGBT 600V 120A TO-3P
FGA60N65SMD IGBT 650V 120A TO-3P
FGA90N33ATDTU IGBT PDP TRENCH 330V 90A TO-3P
相关代理商/技术参数
参数描述
FGA50N100BNTDTU 功能描述:IGBT 晶体管 600V 4 0A UFD RoHS:否 制造商:Fairchild Semiconductor 配置: 集电极—发射极最大电压 VCEO:650 V 集电极—射极饱和电压:2.3 V 栅极/发射极最大电压:20 V 在25 C的连续集电极电流:150 A 栅极—射极漏泄电流:400 nA 功率耗散:187 W 最大工作温度: 封装 / 箱体:TO-247 封装:Tube
FGA50N100BNTTU 功能描述:IGBT 晶体管 N-CH / 50A 1000V NPT Trench RoHS:否 制造商:Fairchild Semiconductor 配置: 集电极—发射极最大电压 VCEO:650 V 集电极—射极饱和电压:2.3 V 栅极/发射极最大电压:20 V 在25 C的连续集电极电流:150 A 栅极—射极漏泄电流:400 nA 功率耗散:187 W 最大工作温度: 封装 / 箱体:TO-247 封装:Tube
FGA50N60LS 功能描述:IGBT 晶体管 IGBT Short Circuit Rated RoHS:否 制造商:Fairchild Semiconductor 配置: 集电极—发射极最大电压 VCEO:650 V 集电极—射极饱和电压:2.3 V 栅极/发射极最大电压:20 V 在25 C的连续集电极电流:150 A 栅极—射极漏泄电流:400 nA 功率耗散:187 W 最大工作温度: 封装 / 箱体:TO-247 封装:Tube
FGA50S110P 功能描述:IGBT 晶体管 1100 V, 50 A Shorted-anode IGBT RoHS:否 制造商:Fairchild Semiconductor 配置: 集电极—发射极最大电压 VCEO:650 V 集电极—射极饱和电压:2.3 V 栅极/发射极最大电压:20 V 在25 C的连续集电极电流:150 A 栅极—射极漏泄电流:400 nA 功率耗散:187 W 最大工作温度: 封装 / 箱体:TO-247 封装:Tube
FGA-60 制造商:Richco 功能描述:Fan Gasket,Black,60MM 制造商:Richco 功能描述:Bulk