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参数资料
| 型号： | FMS6502MTC24 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 3/13页 |
| 文件大小： | 0K |
| 描述： | IC VIDEO SWITCH 8IN/6OUT 24TSSOP |
| 标准包装： | 61 |
| 功能： | 视频交叉点开关 |
| 电路： | 1 x 8:6 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 3.135 V ~ 5.25 V |
| 电流 - 电源： | 55mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 管件 |
FMS6502
8-Input,
6-Output
V
ideo
Switch
Matrix
with
Output
Drivers,
Input
Cl
amp,
and
Bias
Circuitry
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FMS6502 Rev. 1.0.0
11
Layout Considerations
General layout and supply bypassing play a major role in
high-frequency performance and thermal characteristics.
Fairchild offers a demonstration board to guide layout
and aid device evaluation. The demo board is a four-
layer board with full power and ground planes. Following
this layout configuration provides optimum performance
and thermal characteristics for the device. For the best
results, follow the steps and recommended routing rules
listed below.
Recommended Routing/Layout Rules
Do not run analog and digital signals in parallel.
Use separate analog and digital power planes to sup-
ply power.
Traces should run on top of the ground plane at all
times.
No trace should run over ground/power splits.
Avoid routing at 90-degree angles.
Minimize clock and video data trace length differ-
ences.
Include 10F and 0.1F ceramic power supply bypass
capacitors.
Place the 0.1F capacitor within 0.1 inches of the
device power pin.
Place the 10F capacitor within 0.75 inches of the
device power pin.
For multilayer boards, use a large ground plane to
help dissipate heat.
For two-layer boards, use a ground plane that extends
beyond the device body by at least 0.5 inches on all
sides. Include a metal paddle under the device on the
top layer.
Minimize all trace lengths to reduce series inductance.
Thermal Considerations
Since the interior of most systems, such as set-top
boxes, TVs, and DVD players, are at +70C; consider-
ation must be given to providing an adequate heat sink
for the device package for maximum heat dissipation.
When designing a system board, determine how much
power each device dissipates. Ensure that devices of
high power are not placed in the same location, such as
directly above (top plane) or below (bottom plane) each
other on the PCB.
PCB Thermal Layout Considerations
Understand the system power requirements and envi-
ronmental conditions.
Maximize thermal performance of the PCB.
Consider using 70m of copper for high-power
designs.
Make the PCB as thin as possible by reducing FR4
thickness.
Use vias in power pad to tie adjacent layers together.
Remember that baseline temperature is a function of
board area, not copper thickness.
Modeling techniques can provide a first-order approxi-
mation.
Power Dissipation
Worst-case, additional die power due to DC loading can
be estimated at Vcc
2/4R
load per output channel. This
assumes a constant DC output voltage of Vcc/2. For 5V
Vcc with a dual DC video load, add 25/(4*75) = 83mW,
per channel.
Applications for the FMS6502 Video Switch
Matrix
The increased demand for consumer multimedia sys-
tems has created a large challenge for system designers
to provide cost-effective solutions to capitalize on the
growth potential in graphics display technologies. These
applications require cost-effective video switching and fil-
tering solutions to deploy high-quality display technolo-
gies rapidly and effectively to the target audience. Areas
of specific interest include HDTV, media centers, and
automotive infotainment (such as navigation, in-cabin
entertainment, and back-up cameras). In all cases, the
advantages the integrated video switch matrix provides
are high-quality video switching specific to the applica-
tion, as well as video input clamps and on-chip, low-
impedance output cable drivers with switchable gain.
Generally the largest application for a video switch is for
the front-end of an HDTV. This is used to take multiple
inputs and route them to their appropriate signal paths
(main picture and picture-in-picture, or PiP). These are
normally routed into ADCs that are followed by decod-
ers. Technologies for HDTV include LCD, plasma, and
CRT, which have similar analog switching circuitry.
VIPDEMOTM Control Software
The FMS6502 is configured via an I2C-compatible digital
interface. To facilitate demonstration, Fairchild Semicon-
ductor had developed the VIPDEMOTM GUI-based con-
trol software to write to the FMS6502 register map. This
software is included in the FMS6502DEMO kit. A parallel
port I2C adapter and an interface cable to connect to the
demo board are also included. Besides using the full
FMS6502 interface, the VIPDEMOTM can also be used
to control single register read and writes for I2C.
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| FMS6646_09 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Six Channel, SD/HD 1080p Video Filter Driver |
| FMS6646MTC20X | 功能描述:视频 IC Six Chan SD/Full HD Video Filter Driver RoHS:否 制造商:Fairchild Semiconductor 工作电源电压:5 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-28 封装:Reel |
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