参数资料
型号: FMS6690MTC20
厂商: FAIRCHILD SEMICONDUCTOR CORP
元件分类: 消费家电
英文描述: SOGC THICK FILM RESISTOR NETWORKS
中文描述: SPECIALTY CONSUMER CIRCUIT, PDSO20
封装: LEAD FREE, TSSOP-20
文件页数: 11/12页
文件大小: 317K
代理商: FMS6690MTC20
www.fairchildsemi.com
8
FMS6690 Rev. 2B
FMS6690
Six
Channel,
6th
Or
der
SD/PS/HD
Video
Filter
Driver
The same method can be used for biased signals with the addi-
tion of a pull-up resistor to make sure the clamp never operates.
The internal pull-down resistance is 800k ±20% so the exter-
nal resistance should be 7.5M to set the DC level to 500mV. If
a pull-up resistance less than 7.5M is desired, an external
pull-down can be added such that the DC input level is set to
500mV.
Figure 17. Biased SCART with DC-coupled Outputs
The same circuits can be used with AC-coupled outputs if
desired.
Figure 18. DC-coupled Inputs, AC-coupled Outputs
Figure 19. AC-coupled Inputs, AC-coupled Outputs
Figure 20. Biased SCART with AC-coupled Outputs
NOTE: The video tilt or line time distortion will be dominated by
the AC-coupling capacitor. The value may need to be increased
beyond 220F in order to obtain satisfactory operation in some
applications.
Power Dissipation
The FMS6690 output drive conguration must be considered
when calculating overall power dissipation. Care must be taken
not to exceed the maximum die junction temperature. The fol-
lowing example can be used to calculate the FMS6690’s power
dissipation and internal temperature rise.
Tj = TA + Pd ΘJA
where Pd = PCH1 + PCH2 + PCHx
and PCHx = Vs ICH - (VO
2/R
L)
where
VO = 2Vin + 0.280V
ICH = (ICC / 6) + (VO/RL)
Vin = RMS value of input signal
ICC = 60mA
Vs = 5V
RL = channel load resistance
Board layout can also affect thermal characteristics. Refer to the
Layout Considerations Section for more information.
Layout Considerations
General layout and supply bypassing play major roles in high
frequency performance and thermal characteristics. Fairchild
offers a demonstration board, FMS6690DEMO, to use as a
guide for layout and to aid in device testing and characteriza-
tion. The FMS6690DEMO is a 4-layer board with a full power
and ground plane. Following this layout conguration will pro-
vide the optimum performance and thermal characteristics. For
optimum results, follow the steps below as a basis for high fre-
quency layout:
Include 10F and 0.1F ceramic bypass capacitors
Place the 10F capacitor within 0.75 inches of the power pin
Place the 0.1F capacitor within 0.1 inches of the power pin
For multi-layer boards, use a large ground plane to help dissi-
pate heat
For 2 layer boards, use a ground plane that extends beyond
the device by at least 0.5”
Minimize all trace lengths to reduce series inductances
LCVF
Bias
Input
0.1u
External Video
source must
be AC-coupled.
500mV +/-350mV
75
7.5M
75
DVD or
STB
SoC
DAC
Output
75
Ω
LCVF
Clamp
Inactive
0V - 1.4V
220u
DVD or
STB
SoC
DAC
Output
LCVF
Clamp
Active
0.1u
0V - 1.4V
75
Ω
220
μ
LCVF
Clamp
Active
0.1
μ
External video
source must
be AC-coupled.
500mV +/-350mV
220
μ
75
Ω
7.5M
Ω
75
Ω
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