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| 型号： | FSLBOT |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 21/46页 |
| 文件大小： | 0K |
| 描述： | KIT TOWER MECH BOARD |
| 视频文件： | Freescale Tower Overview - Another Geek Moment Freescale Tower Labs 1 & 2 - Another Geek Moment |
| 特色产品： | Tower Mechatronics Board and Robot |
| 标准包装： | 1 |
| 系列： | ColdFire® |
| 主要目的： | 机器人 |
| 嵌入式： | 否 |
| 主要属性： | 步行机器人结构 |
| 已供物品： | 线路板，4 PWM 伺服系统，用户指南，汇编指令 |
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Electrical Characteristics
MCF52259 ColdFire Microcontroller, Rev. 5
Freescale
28
2.4
Flash Memory Characteristics
16 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
17 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
18 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (TJ) in C can be obtained from:
(1)
Where:
TA
= ambient temperature,
C
JA
= package thermal resistance, junction-to-ambient,
C/W
PD
= PINT PI/O
PINT
= chip internal power, IDD VDD, W
PI/O
= power dissipation on input and output pins — user determined, W
For most applications PI/O PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
(2)
Solving equations 1 and 2 for K gives:
K = PD (TA + 273 C) + JMA PD
2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for
any value of TA.
Table 9. SGFM Flash Program and Erase Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Min
Typ
Max
Unit
System clock (read only)
fsys(R)
0—
66.67 or 801
1
Depending on packaging; see the orderable part number summary (Table 2).
MHz
System clock (program/erase)2
2 Refer to the flash memory section for more information (Section 2.4, “Flash Memory Characteristics”)
fsys(P/E)
0.15
—
66.67 or 801
MHz
Table 10. SGFM Flash Module Life Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Value
Unit
Maximum number of guaranteed program/erase cycles1 before failure
1 A program/erase cycle is defined as switching the bits from 1
0 1.
P/E
10,0002
Cycles
Data retention at average operating temperature of 85
C
Retention
10
Years
TJ
TA
PD JMA
+
=
PD
KTJ 273C
+
=
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