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参数资料
| 型号： | GL4800E0000F |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 6/9页 |
| 文件大小： | 0K |
| 描述： | EMITTER IR 950NM 3.0MW TH |
| 产品变化通告： | Emitter Chip Change 10/Aug/2007 |
| 标准包装： | 1,000 |
| 电流 - DC 正向(If)： | 100mA |
| 辐射强度(le)最小值@正向电流： | 0.7mW/sr @ 20mA |
| 波长： | 950nm |
| 正向电压： | 1.2V |
| 视角： | 60° |
| 方向： | 侧视图 |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 包装： | 袋 |
| 其它名称： | 425-1939-5 |
GL4800E0000F
■ Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50 % deg-
radation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Soldering Instructions
1. Sharp recommends not soldering this part using preheat or solder reflow methods.
2. If hand soldering, use temperatures ≤ 260°C for ≤ 3 seconds.
3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the
solder, the pad, and the circuit board.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Storage and Handling
1. Sharp recommends storing these parts between 5°C and 30°C, at a relative humidity of less than 60 % .
2. After breaking the package seal, Sharp recommends maintaining the environment within 5° to 30°C, at a relative
humidity of less than 60 % .
■ Packing Specifications
1.
2.
3.
4.
Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag.
Bags are secured in a box as shown in illustration on page 7.
Product mass: 0.07 g (approximately)
Sharp guarantees the following:
a. Missing parts will not make up more than 0.1 % of the total quantity.
b. Parts will be easily removed from the packing.
6
Sheet No.: D1-A01001EN
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| GL480E00000F | 功能描述:红外发射源 Thru hole IRED 0.7mW 950nm RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
| GL480-E00000F | 制造商:Sharp Microelectronics 功能描述:LED IrLED 950nm 2-Pin |
| GL480E0000F5 | 制造商:Sharp Microelectronics Corporation 功能描述:Opto,Em. infrared diode,950nm,side view |
| GL480Q | 制造商:Sharp Microelectronics Corporation 功能描述:1.6 mm, 1 ELEMENT, INFRARED LED, 950 nm |
| GL480QE0000F | 功能描述:红外发射源 Hi rel version of GL480 RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk |
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