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参数资料
| 型号： | HMMC-5034 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 放大器 |
| 英文描述： | 37000 MHz - 43000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | 0.0614 X 0.0401 INCH, DIE |
| 文件页数： | 7/8页 |
| 文件大小： | 210K |
| 代理商： | HMMC-5034 |
This data sheet contains a variety of typical and guaranteed performance data. The information supplied should not
be interpreted as a complete list of circuit specifications. In this data sheet the term typical refers to the 50th per-
centile performance. For additional information contact your local Agilent Technologies’ sales representative.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright 2002 Agilent Technologies, Inc.
August 30, 2002
5988-3203EN
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PDF描述 |
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| HMMC-5220 | 0 MHz - 15000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMMC-5038 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:38 GHz LNA |
| HMMC-5040 | 制造商:Agilent Technologies 功能描述:RF AMP CHIP SGL GP 40GHZ 5V - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-5200 | 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GAIN AMP CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-5220 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:DC-15 GHz HBT Series-Shunt Amplifier |
| HMMC-5617 | 制造商:Agilent Technologies 功能描述:DC-18 GHZ GAAS MMIC AMPLIFIER - Gel-pak, waffle pack, wafer, diced wafer on film |
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