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参数资料
| 型号： | HSMS-2863-TR2 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 参考电压二极管 |
| 英文描述： | SILICON, UHF-C BAND, MIXER DIODE |
| 封装： | SOT-23, 3 PIN |
| 文件页数： | 5/17页 |
| 文件大小： | 205K |
| 代理商： | HSMS-2863-TR2 |
13
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 33
(dimensions are in inches).
0.026
0.039
0.079
0.022
Dimensions in inches
Figure 33. Recommended PCB Pad
Layout for Agilent’s SC70 3L/SOT-323
Products.
A recommended PCB pad layout
for the miniature SOT-363 (SC-70
6 lead) package is shown in
Figure 34 (dimensions are in
inches). This layout provides
ample allowance for package
placement by automated assem-
bly equipment without adding
parasitics that could impair the
performance.
0.026
0.079
0.018
0.039
Dimensions in inches
Figure 34. Recommended PCB Pad
Layout for Agilent’s SC70 6L/SOT-363
Products.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
packages, will reach solder
reflow temperatures faster than
those with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 35. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
Figure 35. Surface Mount Assembly Profile.
TIME (seconds)
T
MAX
TEMPERATURE
(
°C)
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evapo-
rating solvents from the solder
paste. The reflow zone briefly
elevates the temperature suffi-
ciently to produce a reflow of the
solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235
°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures
and times necessary to achieve a
uniform reflow of solder.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HSMS-2863-TR2G | 功能描述:射频检测器 4 VBR 0.3 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 频率范围:650 MHz to 3 GHz 最大二极管电容: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SC-88 封装:Reel |
| HSMS-2864 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Microwave Schottky Detector Diodes |
| HSMS-2864-BLKG | 功能描述:射频检测器 4 VBR 0.3 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 频率范围:650 MHz to 3 GHz 最大二极管电容: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SC-88 封装:Reel |
| HSMS-2864-TR1G | 功能描述:射频检测器 4 VBR 0.3 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 频率范围:650 MHz to 3 GHz 最大二极管电容: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SC-88 封装:Reel |
| HSMS-2864-TR2G | 功能描述:射频检测器 4 VBR 0.3 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 频率范围:650 MHz to 3 GHz 最大二极管电容: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SC-88 封装:Reel |
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