参数资料
型号: HUF75852G3
厂商: Fairchild Semiconductor
文件页数: 1/10页
文件大小: 0K
描述: MOSFET N-CH 150V 75A TO-247
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Lead Frame Change 20/Dec/2007
标准包装: 150
系列: UltraFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 150V
电流 - 连续漏极(Id) @ 25° C: 75A
开态Rds(最大)@ Id, Vgs @ 25° C: 16 毫欧 @ 75A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 480nC @ 20V
输入电容 (Ciss) @ Vds: 7690pF @ 25V
功率 - 最大: 500W
安装类型: 通孔
封装/外壳: TO-247-3
供应商设备封装: TO-247
包装: 管件
其它名称: HUF75852G3-ND
HUF75852G3FS
HUF75852G3
Data Sheet
N-Channel UltraFET Power MOSFET
150 V, 75 A, 16 m?
Packaging
JEDEC TO-247
SOURCE
DRAIN
GATE
DRAIN
(TAB)
Symbol
October 20 13
Features
? Ultra Low On-Resistance
- r DS(ON) = 0.016 ?, V GS = 10V
? Simulation Models
- Temperature Compensated PSPICE? and SABER?
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
? Peak Current vs Pulse Width Curve
? UIS Rating Curve
Ordering Information
D
PART NUMBER
HUF75852G3
PACKAGE
TO-247
BRAND
75852G
G
S
Absolute Maximum Ratings
T C = 25 o C, Unless Otherwise Specified
HUF75852G3
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V DSS
Drain to Gate Voltage (R GS = 20k ? ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V GS
Drain Current
Continuous (T C = 25 o C, V GS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Continuous (T C = 100 o C, V GS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P D
Derate Above 25 o C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T J , T STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T L
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T pkg
150
150
± 20
75
75
Figure 4
Figures 6, 14, 15
500
3.33
-55 to 175
300
260
V
V
V
A
A
W
W/ o C
o C
o C
o C
NOTE:
1. T J = 25 o C to 150 o C.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html
For severe environments, see our Automotive HUFA series.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
?2001 Fairchild Semiconductor Corporation
HUF75852G3 Rev. C0
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