参数资料
型号: IBM25PPC750FX-GB0132T
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292
封装: 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件页数: 17/62页
文件大小: 452K
代理商: IBM25PPC750FX-GB0132T
DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
4. Dimensions and Signal Assignments
Page 22 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
4. Dimensions and Signal Assignments
IBM offers a ceramic ball grid array (CBGA) which supports 292 balls for the 750FX package.
4.1 Module Substrate Decoupling Voltage Assignments
The on-board substrate voltage-to-ground assignments for the capacitor locations are shown in Figure 4-1.
4.2 Package
Module mass is approximately 3.25 grams. Ball pitch is 1 mm. Ball diameter target is 0.8 mm +/- 0.04 mm.
JEDEC moisture sensitivity level is 1. For pad, line, via, and dogbone recommendations, ask for “Printed
Wiring Board Tech For 1.0 mm Pitch Modules.”
Note: Use A01 corner designation for correct placement. Use the five plated dots that form a right angle (|_)
Figure 4-1. Module Substrate Decoupling Voltage Assignments
A01
47P6892
Corner
GND
VDD
OVDD
GND
VDD
OVDD
GND
VDD
GND
OVDD
GND
OVDD
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