参数资料
型号: IBM25PPC750FX-GB0132T
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292
封装: 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件页数: 6/62页
文件大小: 452K
代理商: IBM25PPC750FX-GB0132T
DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
3. Electrical and Thermal Characteristics
Page 12 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
Previous revisions of this datasheet showed incorrectly low power dissipation values. The power dissipation
of the 750FX has not increased, the datasheet has only been corrected to show the actual values.
Table 3-5. Power Consumption
See Table 3-2 on page 10 for recommended operating conditions.
Mode
VDD
Tj
Representative Processor Frequency (see note 6)
Unit
Notes
400 MHz
600 MHz
700 MHz
733 MHz
800 MHz
Full-On Mode
Maximum
1.45V
105C
7.1
7.9
8.2
8.3
8.6
1, 2
1.5V
105C
7.9
8.7
9.3
9.4
9.7
1, 2
Typical
1.45V
85C
3.9
4.6
5.0
5.1
5.4
1, 3
Nap Mode
Typical
1.45V
50C
1.4
1.5
1.6
W
1
Sleep Mode
Typical
1.45V
50C
1.4
W
1
Notes:
1. These values apply for all valid 60x buses. The values do not include I/O Supply Power (OVDD) or PLL/DLL supply power (AVDD). OVDD power is sys-
tem dependent, but is typically <2% of VDD power. AVDD current is less than 25mA each for AVDD1 and AVDD2.
2. Maximum power is specified for fastest (worst process) parts running RC5 at the indicated core voltage, junction temperature, and core frequency.
3. Typical power is specified for median process 800 MHz parts0 running RC5 at the indicated core voltage, junction temperature, and core frequency.
The value is then adjusted for 13% less switching (AC component for PD) to account for the differences between RC5 and more typical application
code.
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