参数资料
型号: IBM25PPC750FX-GB0132T
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292
封装: 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件页数: 3/62页
文件大小: 452K
代理商: IBM25PPC750FX-GB0132T
DD 2.X
Preliminary
PowerPC 750FX RISC Microprocessor
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
3. Electrical and Thermal Characteristics
Page 9 of 63
3. Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the 750FX.
3.1 DC Electrical Characteristics
The tables in this section describe the DC electrical characteristics for the 750FX.
Table 3-1. Absolute Maximum Ratings1
Characteristic
Symbol
1.8V
2.5V
3.3V
Unit
Notes
Core supply voltage
VDD
-0.3 to 1.6
V
3, 4
PLL supply voltage
A1VDD, A2VDD
-0.3 to 1.6
V
3, 4, 5
60x bus supply voltage
OVDD
-0.3 to 2.0
-0.3 to 2.75
-0.3 to 3.7
V
3, 4
Input voltage
VIN
-0.3 to 2.0
-0.3 to 2.75
-0.3 to 3.7
V
2
Storage temperature range
TSTG
-55 to 150
°C
Notes:
1. Functional and tested operating conditions are given in Table 3-2, “Recommended Operating Conditions” on page 10. Absolute
maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those
listed above may affect device reliability or cause permanent damage to the device.
2. Caution: Transient VIN overshoots of up to OVDD + 0.8V, with a maximum of 4.0V for 3.3V operation, and undershoots down to
GND - 0.8V, are allowed for up to 5ns.
3. Caution: OVDD must not exceed VDD/AVDD by more than 2.1V continuously. OVDD may exceed VDD/AVDD by up to 2.3V for up
to 20ms during power-on or power-off. OVDD must not exceed VDD/AVDD by more than 2.3V for any amount of time.
4. Caution: VDD/AVDD must not exceed OVDD by more than 1.0V continuously. VDD/AVDD may exceed OVDD by up to 1.6v for up
to 20ms during power-on or power-off. VDD/AVDD must not exceed OVDD by more than 1.6V for any amount of time.
5. Caution: AVDD must not exceed VDD by more than 0.5V at any time.
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