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| 型号： | IBM25PPC750FX-GB0132T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| 封装： | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件页数： | 48/62页 |
| 文件大小： | 452K |
| 代理商： | IBM25PPC750FX-GB0132T |
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DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
5. System Design Information
Page 50 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
T
J = TA + TR + (
θ
JC +
θ
INT +
θ
SA)
× P
D
Where:
T
J is the die-junction temperature
T
A is the inlet cabinet ambient temperature
T
R is the air temperature rise within the system cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the thermal resistance of the thermal interface material
θ
SA is the heat sink-to-ambient thermal resistance
P
D is the power dissipated by the device
Typical die-junction temperatures (T
J) should be maintained less than the value specified in Table 3-3
Package Thermal Characteristics1 on page 10. The temperature of the air cooling the component greatly
depends upon the ambient inlet air temperature and the air temperature rise within the computer cabinet. An
electronic cabinet inlet-air temperature (T
A) may range from 30 to 40
°C. The air temperature rise within a
cabinet (T
R) may be in the range of 5 to 10
°C. The thermal resistance of the interface material (θ
INT) is typically
about 1
°C/W. Assuming a T
A of 30
°C,aT
R of 5
°C, a CBGA package θ
JC = 0.03, and a power dissipation (PD)of
5.0 watts, the following expression for T
J is obtained.
Die-junction temperature: T
J = 30
°C + 5°C + (0.03°C/W +1.0°C/W + θ
SA)
× 5W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
SA) versus air flow velocity
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相关代理商/技术参数 |
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|---|---|
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