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参数资料
| 型号： | ICS5342-2 |
| 英文描述： | Analog IC |
| 中文描述： | 模拟IC |
| 文件页数： | 26/36页 |
| 文件大小： | 1017K |
| 代理商： | ICS5342-2 |
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ICS5342
GENDAC
32
Recommended Layout
VIA to power plane
VIA to ground plane
AGND
RED
AVDD
CVDD
GRN
BLUE
RSET
DVDD
PCLK
XVDD
XGND
XOUT
XIN
CLK0
36
35
34
33
32
31
30
29
28
27
40
39
38
37
43
42
41
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
1
2
3
4
5
6
7
8
9
68
64
65
66
67
61
62
63
GENDAC II
ICS5342
CLK1
DGND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
R4
R2
R4
R5
R1
C2
VAA
C1
FB1
C3
-
+
C1 0.047
F chip capacitor
C2 0.1
F chip capacitor
C3 10
F tantalum capacitor
FB1 ferrite bead, Fair-Rite 2743019447
R1 33 ohm
R2 100 ohm
R3 141 ohm, 1%
R4 220 ohm
R5 560 ohm
Y1 parallel resonant crystal cut for C
L = 12 pF
C2
LOCATE NEAR
CONTROLLER
LOCATE NEAR
CONTROLLER
C1
C2
R3
VAA
C2
Y1
VAA
C2
VREF
CGND
DGND
CVDD
CGND
5342_30
Board Layout and Analog Signal Consider-
ations
The high performance of the GENDAC is dependent on care-
ful PC board layout. The use of a four layer board (internal
power and ground planes, signals on the two surface layers) is
recommended. The ground plane layer should be closest to the
component side of the board. The layout following this sec-
tion shows a suggested configuration.
Power Supply
As a high speed CMOS device, the GENDAC may draw large
transient currents from the power supply. It is necessary to
adopt high-frequency board-layout and power-distribution
techniques to assure proper operation of the GENDAC. This
will also minimize radio frequency interference (RFI). DAC
to DAC crosstalk can also be attributed to a high impedance
power supply.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS5342-3 | 制造商:ICS 制造商全称:ICS 功能描述:Analog IC |
| ICS5342ADD | 制造商:ICS 制造商全称:ICS 功能描述:Addendum to ICS5342 Data Sheet |
| ICS5342V | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Peripheral IC |
| ICS541 | 制造商:ICS 制造商全称:ICS 功能描述:PRELIMINARY INFORMATION PLL Clock Divider |
| ICS541M | 制造商:ICS 制造商全称:ICS 功能描述:PRELIMINARY INFORMATION PLL Clock Divider |
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