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| 型号： | ICS813078BYILF |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 13/26页 |
| 文件大小： | 0K |
| 描述： | IC VCXO PLL WIRELESS 64TQFP |
| 标准包装： | 160 |
| 系列： | HiPerClockS™, FemtoClock™ |
| 类型： | 时钟/频率发生器，扇出缓冲器（分配），抖动衰减器，多路复用器 |
| PLL： | 是 |
| 主要目的： | 无线基础架构应用 |
| 输入： | LVDS，LVHSTL，LVPECL，晶体 |
| 输出： | LVPECL |
| 电路数： | 1 |
| 比率 - 输入:输出： | 3:9 |
| 差分 - 输入:输出： | 是/是 |
| 频率 - 最大： | 614.4MHz |
| 电源电压： | 3.135 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-TQFP 裸露焊盘 |
| 供应商设备封装： | 64-TQFP-EP（10x10） |
| 包装： | 托盘 |
ICS813078I
FEMTOCLOCKS VCXO-PLL FREQUENCY GENERATOR
FEMTOCLOCKS VCXO-PLL FREQUENCY GENERATOR
20
ICS813078BYI REV. A OCTOBER 6, 2008
EPAD Thermal Release Path
In order to maximize both the removal of heat from the package
and the electrical performance, a land pattern must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in Figure 6. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias. The
vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are
application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended to
determine the minimum number needed. Maximum thermal and
electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as many
vias connected to ground as possible. It is also recommended that
the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz
copper via barrel plating. This is desirable to avoid any solder
wicking inside the via during the soldering process which may
result in voids in solder between the exposed pad/slug and the
thermal land. Precautions should be taken to eliminate any solder
voids between the exposed heat slug and the land pattern. Note:
These recommendations are to be used as a guideline only. For
further information, refer to the Application Note on the Surface
Mount Assembly of Amkor’s Thermally/Electrically Enhance
Leadfame Base Package, Amkor Technology.
Figure 6. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale)
GROUND PLANE
LAND PATTERN
SOLDER
THERMAL VIA
EXPOSED HEAT SLUG
(GROUND PAD)
PIN
PIN PAD
SOLDER
PIN
PIN PAD
SOLDER
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ICS813078BYILFT | 功能描述:IC VCXO PLL WIRELESS 64TQFP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 专用 系列:HiPerClockS™, FemtoClock™ 标准包装:1,500 系列:- 类型:时钟缓冲器/驱动器 PLL:是 主要目的:- 输入:- 输出:- 电路数:- 比率 - 输入:输出:- 差分 - 输入:输出:- 频率 - 最大:- 电源电压:3.3V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SSOP（0.209"，5.30mm 宽） 供应商设备封装:28-SSOP 包装:带卷 (TR) 其它名称:93786AFT |
| ICS813078I | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:FEMTOCLOCKS? VCXO-PLL FREQUENCY GENERATOR FOR WIRELESS INFRASTRUCTURE EQUIPMENT |
| ICS813252CKI-02LF | 功能描述:IC MULTIPLIER VCXO PLL 32-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ICS813252CKI-02LFT | 功能描述:IC MULTIPLIER VCXO PLL 32-VFQFPN RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:HiPerClockS™, FemtoClock™ 标准包装:27 系列:Precision Edge® 类型:频率合成器 PLL:是 输入:PECL，晶体 输出:PECL 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:无/是 频率 - 最大:800MHz 除法器/乘法器:是/无 电源电压:3.135 V ~ 5.25 V 工作温度:0°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| ICS813252I-02 | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:VCXO JITTER ATTENUATOR & FEMTOCLOCK? MULTIPLIER |
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