参数资料
型号: IDT7009L20PFI
厂商: IDT, Integrated Device Technology Inc
文件页数: 2/17页
文件大小: 0K
描述: IC SRAM 1MBIT 20NS 100TQFP
标准包装: 6
格式 - 存储器: RAM
存储器类型: SRAM - 双端口,异步
存储容量: 1M (128K x 8)
速度: 20ns
接口: 并联
电源电压: 4.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
供应商设备封装: 100-TQFP(14x14)
包装: 托盘
其它名称: 7009L20PFI
IDT7009L
High-Speed 128K x 8 Dual-Port Static RAM
Description
The IDT7009 is a high-speed 128K x 8 Dual-Port Static RAM. The
IDT7009 is designed to be used as a stand-alone 1024K-bit Dual-Port
RAM or as a combination MASTER/SLAVE Dual-Port RAM for 16-bit-or-
more word systems. Using the IDT MASTER/SLAVE Dual-Port RAM
approach in 16-bit or wider memory system applications results in full-
speed, error-free operation without the need for additional discrete logic.
This device provides two independent ports with separate control,
Pin Configurations (1,2,3)
11/16/01
Index
Industrial and Commercial Temperature Ranges
address, and I/O pins that permit independent, asynchronous access for
reads or writes to any location in memory. An automatic power down
feature controlled by the chip enables ( CE 0 and CE 1 ) permit the on-chip
circuitry of each port to enter a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology, these
devices typically operate on only1W of power.
The IDT7009 is packaged in a 100-pin Thin Quad Flatpack (TQFP).
75
NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
NC
NC
A 7L
A 8L
A 9L
A 10L
A 11L
A 12L
A 13L
2
3
4
5
6
7
8
9
74
73
72
71
70
69
68
67
NC
A 7R
A 8R
A 9R
A 10R
A 11R
A 12R
A 13R
A 14L
A 15L
A 16L
Vcc
NC
NC
NC
NC
CE 0L
CE 1L
SEM L
R/ W L
OE L
GND
NC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IDT7009PF
PN100-1 (4)
100-Pin TQFP
Top View (5)
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
A 14R
A 15R
A 16R
GND
NC
NC
NC
NC
CE 0R
CE 1R
SEM R
R/ W R
OE R
GND
GND
25
NC
51
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NC
4839 drw 02
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
2
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