参数资料
型号: IR3510MPBF
厂商: International Rectifier
文件页数: 35/36页
文件大小: 0K
描述: IC XPHASE CONTROL 32-MLPQ
标准包装: 100
系列: XPhase™
应用: 处理器
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-MLPQ(5x5)
包装: 剪切带 (CT)
IR3510
STENCIL DESIGN
? The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the
amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the leads
are only 0.25mm wide, the stencil apertures should not be made narrower; openings in stencils < 0.25mm wide are
difficult to maintain repeatable solder release.
? The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead land.
? The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately 50% area
of solder on the center pad. If too much solder is deposited on the center pad the part will float and the lead lands
will be open.
? The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus
an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is
pushed into the solder paste.
Page 35 of 36
IR Confidential
May 18, 2009
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