参数资料
型号: IR3513ZMTRPBF
厂商: International Rectifier
文件页数: 34/36页
文件大小: 0K
描述: IC CTRL XPHASE3 POL 32-MLPQ
标准包装: 3,000
系列: XPhase3™
应用: 处理器
电流 - 电源: 3mA
电源电压: 8 V ~ 16 V
工作温度: 0°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-MLPQ(5x5)
包装: 带卷 (TR)
NOT RECOMMENDED FOR NEW DESIGNS
REPLACEMENT PRODUCT – IR3513ZMTRPBF
IR3513
Solder Resist
? The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm.
? At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of ≥ 0.17mm remains.
? The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
? Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
? The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
Page 34
May 11, 2008
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相关代理商/技术参数
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IR3515SPBF 制造商:International Rectifier 功能描述:MOSFET, Power;N-Ch;VDSS 150V;RDS(ON) 0.045Ohm;ID 41A;D2Pak;PD 200W;VGS +/-30V